Division operations in memory

ABSTRACT

Examples of the present disclosure provide apparatuses and methods related to performing division operations in memory. An example apparatus might include a first group of memory cells coupled to a first access line and configured to store a dividend element. An example apparatus might include a second group of memory cells coupled to a second access line and configured to store a divisor element. An example apparatus might also include a controller configured to cause the dividend element to be divided by the divisor element by controlling sensing circuitry to perform a number of operations without transferring data via an input/output (I/O) line.

PRIORITY INFORMATION

This application is a Continuation of U.S. application Ser. No.14/836,673, filed Aug. 26, 2015, which claims the benefit of U.S.Provisional Application No. 62/045,175, filed Sep. 3, 2014, the contentsof which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memoryapparatuses and methods, and more particularly, to apparatuses andmethods related to performing division operations in a memory.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic systems. There aremany different types of memory including volatile and non-volatilememory. Volatile memory can require power to maintain its data (e.g.,host data, error data, etc.) and includes random access memory (RAM),dynamic random access memory (DRAM), static random access memory (SRAM),synchronous dynamic random access memory (SDRAM), and thyristor randomaccess memory (TRAM), among others. Non-volatile memory can providepersistent data by retaining stored data when not powered and caninclude NAND flash memory, NOR flash memory, and resistance variablememory such as phase change random access memory (PCRAM), resistiverandom access memory (RRAM), and magnetoresistive random access memory(MRAM), such as spin torque transfer random access memory (STT RAM),among others.

Electronic systems often include a number of processing resources (e.g.,one or more processors), which may retrieve and execute instructions andstore the results of the executed instructions to a suitable location. Aprocessor can comprise a number of functional units (e.g., hereinreferred to as functional unit circuitry (FUC)) such as arithmetic logicunit (ALU) circuitry, floating point unit (FPU) circuitry, and/or acombinatorial logic block, for example, which can execute instructionsto perform logical operations such as AND, OR, NOT, NAND, NOR, and XORlogical operations on data (e.g., one or more operands).

A number of components in an electronic system may be involved inproviding instructions to the functional unit circuitry for execution.The instructions may be generated, for instance, by a processingresource such as a controller and/or host processor. Data (e.g., theoperands on which the instructions will be executed to perform thelogical operations) may be stored in a memory array that is accessibleby the FUC. The instructions and/or data may be retrieved from thememory array and sequenced and/or buffered before the FUC begins toexecute instructions on the data. Furthermore, as different types ofoperations may be executed in one or multiple clock cycles through theFUC, intermediate results of the operations and/or data may also besequenced and/or buffered.

In many instances, the processing resources (e.g., processor and/orassociated FUC) may be external to the memory array, and data can beaccessed (e.g., via a bus between the processing resources and thememory array) to execute instructions. Data can be moved from the memoryarray to registers external to the memory array via a bus.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of an apparatus in the form of a computingsystem including a memory device in accordance with a number ofembodiments of the present disclosure.

FIG. 2A illustrates a schematic diagram of a portion of a memory arrayin accordance with a number of embodiments of the present disclosure.

FIG. 2B illustrates a schematic diagram of a portion of a memory arrayin accordance with a number of embodiments of the present disclosure.

FIG. 3 illustrates a schematic diagram of a portion of a memory array inaccordance with a number of embodiments of the present disclosure.

FIG. 4A illustrates a table showing the states of memory cells of anarray at a particular phase associated with performing a divisionoperation in accordance with a number of embodiments of the presentdisclosure.

FIG. 4B illustrates a table showing the states of memory cells of anarray at a particular phase associated with performing a divisionoperation in accordance with a number of embodiments of the presentdisclosure.

FIG. 4C illustrates a table showing the states of memory cells of anarray at a particular phase associated with performing a divisionoperation in accordance with a number of embodiments of the presentdisclosure.

FIG. 4D illustrates a table showing the states of memory cells of anarray at a particular phase associated with performing a divisionoperation in accordance with a number of embodiments of the presentdisclosure.

FIG. 4E illustrates a table showing the states of memory cells of anarray at a particular phase associated with performing a divisionoperation in accordance with a number of embodiments of the presentdisclosure.

FIG. 4F illustrates a table showing the states of memory cells of anarray at a particular phase associated with performing a divisionoperation in accordance with a number of embodiments of the presentdisclosure.

FIG. 5 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

FIG. 6 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

FIG. 7 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

FIG. 8 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

FIG. 9 illustrate a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

FIG. 10 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

FIG. 11 is a schematic diagram illustrating sensing circuitry havingselectable logical operation selection logic in accordance with a numberof embodiments of the present disclosure.

FIG. 12 is a logic table illustrating selectable logic operation resultsimplemented by a sensing circuitry in accordance with a number ofembodiments of the present disclosure.

DETAILED DESCRIPTION

The present disclosure includes apparatuses and methods related toperforming division operations in a memory. A division operation can beperformed on a plurality of dividend elements and a plurality of divisorelements. The plurality of dividend elements and the plurality ofdivisor elements can be stored in a plurality of groups memory cellscoupled to different access lines. For example, a first group of memorycells coupled to a first access line can be configured to store theplurality of dividend elements. A second group of memory cells coupledto a second access line can be configured to store the plurality ofdivisor elements. The division operation can include a controllerconfigured to divide the dividend element by the divisor element bycontrolling sensing circuitry to perform a number of operations withouttransferring data via an input/output (I/O) line.

Dividing the dividend elements by the divisor elements includesperforming a division operation on element pairs (e.g., data in the formof bit-vectors stored in an array). Performing the division operation onelement pairs can include performing the division operation on a firstdividend element from the plurality of dividend elements and a firstdivisor element from a plurality of divisor elements from a firstelement pair, on a second dividend element from the plurality ofdividend elements and a second divisor element from the plurality ofdivisor elements from the second element pair, etc. Performing thedivision operation on a plurality of element pairs may be described asperforming a first division operation on a first element pair, a seconddivision operation on a second element pair, etc.

The division operation can be performed on element pairs in parallel.For example, the division operation can be performed on elements fromthe first element pair and elements from the second element pair inparallel.

As used herein, the plurality of dividend elements and the plurality ofdivisor elements can be numerical values that are divided. That is, adividend element can be divided by a divisor element. A divisionoperation can be used to determine a quotient element (e.g., quotientvalue) and a remainder element (e.g., remainder value). As used herein,the quotient element is defined as the number of times the divisorelement divides into the dividend element. That is, the quotient elementcan be the integer part of the result of the division operation. Theremainder element is defined as the remaining portion of the dividendelement after the divisor element divides the dividend element. That is,the remainder element can be the non-integer part of the result of thedivision operation. However, the remainder element can be expressed asan integer value.

In a number of examples, an element can represent an object and/or otherconstruct, which may be represented by a bit-vector. As an example, adivision operation can be performed to divide objects by dividing thebit-vectors that represent the respective objects.

A number of embodiments of the present disclosure can provide areduction of the number of operations (e.g., computations, functions,etc.) and/or time involved in performing a number of division operations(e.g., division functions) relative to previous approaches. Forinstance, the number of computations and/or the time can be reduced dueto an ability to perform various division operations in parallel (e.g.,simultaneously). Performing a number of division operations as describedherein can also reduce power consumption as compared to previousapproaches. In accordance with a number of embodiments, a divisionoperation can be performed on elements without transferring data out ofthe memory array and/or sensing circuitry via a bus (e.g., data bus,address bus, control bus, etc.). A division operation can involveperforming a number of logical operations in parallel. For example, adivision operation can include performing a plurality of AND operationsin parallel, a plurality of OR operations in parallel, a plurality ofSHIFT operations in parallel, a plurality of INVERT operations inparallel, etc. However, embodiments are not limited to these examples.

In various previous approaches, a dividend element and a divisor elementassociated with a division operation may be transferred from the arrayand sensing circuitry to a number of registers via a bus comprisinginput/output (I/O) lines. The number of registers can be used by aprocessing resource such as a processor, microprocessor, and/or computeengine, which may comprise ALU circuitry and/or other functional unitcircuitry configured to perform the appropriate logical operations.However, often only a single division operation can be performed by theALU circuitry, and transferring data to/from memory from/to registersvia a bus can involve significant power consumption and timerequirements. Even if the processing resource is located on a same chipas the memory array, significant power can be consumed in moving dataout of the array to the compute circuitry (e.g., ALU), which can involveperforming a sense line address access (e.g., firing of a column decodesignal) in order to transfer data from sense lines onto I/O lines,moving the data to the array periphery, and providing the data to aregister in association with performing a division operation, forinstance.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how one or more embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure. As used herein, the designators “M,” “N,”“J,” “R,” “S,” “U,” “V,” “X,” “Y,” and “W,” particularly with respect toreference numerals in the drawings, indicates that a number of theparticular feature so designated can be included. As used herein, “anumber of” a particular thing can refer to one or more of such things(e.g., a number of memory arrays can refer to one or more memoryarrays).

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 130 may referenceelement “30” in FIG. 1, and a similar element may be referenced as 230in FIG. 2. As will be appreciated, elements shown in the variousembodiments herein can be added, exchanged, and/or eliminated so as toprovide a number of additional embodiments of the present disclosure. Inaddition, as will be appreciated, the proportion and the relative scaleof the elements provided in the figures are intended to illustratecertain embodiments of the present invention, and should not be taken ina limiting sense.

FIG. 1 is a block diagram of an apparatus in the form of a computingsystem 100 including a memory device 160 in accordance with a number ofembodiments of the present disclosure. As used herein, a memory device160, a memory array 130, and/or sensing circuitry 150 might also beseparately considered an “apparatus.”

System 100 includes a host 110 coupled to memory device 160, whichincludes a memory array 130. Host 110 can be a host system such as apersonal laptop computer, a desktop computer, a digital camera, a mobiletelephone, or a memory card reader, among various other types of hosts.Host 110 can include a system motherboard and/or backplane and caninclude a number of processing resources (e.g., one or more processors,microprocessors, or some other type of controlling circuitry). Thesystem 100 can include separate integrated circuits or both the host 110and the memory device 160 can be on the same integrated circuit. Thesystem 100 can be, for instance, a server system and/or a highperformance computing (HPC) system and/or a portion thereof. Althoughthe example shown in FIG. 1 illustrates a system having a Von Neumannarchitecture, embodiments of the present disclosure can be implementedin non-Von Neumann architectures (e.g., a Turing machine), which may notinclude one or more components (e.g., CPU, ALU, etc.) often associatedwith a Von Neumann architecture.

For clarity, the system 100 has been simplified to focus on featureswith particular relevance to the present disclosure. The memory array130 can be a DRAM array, SRAM array, STT RAM array, PCRAM array, TRAMarray, RRAM array, NAND flash array, and/or NOR flash array, forinstance. The array 130 can comprise memory cells arranged in rowscoupled by access lines (which may be referred to herein as word linesor select lines) and columns coupled by sense lines (which may bereferred to herein as digit lines or data lines). Although a singlearray 130 is shown in FIG. 1, embodiments are not so limited. Forinstance, memory device 160 may include a number of arrays 130 (e.g., anumber of banks of DRAM cells). An example DRAM array is described inassociation with FIG. 2.

The memory device 160 includes address circuitry 142 to latch addresssignals provided over an I/O bus 156 (e.g., a data bus) through I/Ocircuitry 144. Address signals are received and decoded by a row decoder146 and a column decoder 152 to access the memory array 130. Data can beread from memory array 130 by sensing voltage and/or current changes onthe sense lines using sensing circuitry 150. The sensing circuitry 150can read and latch a page (e.g., row) of data from the memory array 130.The I/O circuitry 144 can be used for bi-directional data communicationwith host 110 over the I/O bus 156. The write circuitry 148 is used towrite data to the memory array 130.

Controller 140 decodes signals provided by control bus 154 from the host110. These signals can include chip enable signals, write enablesignals, and address latch signals that are used to control operationsperformed on the memory array 130, including data read, data write, anddata erase operations. In various embodiments, the controller 140 isresponsible for executing instructions from the host 110. The controller140 can be a state machine, a sequencer, or some other type ofcontroller.

An example of the sensing circuitry 150 is described further below inassociation with FIG. 2. For instance, in a number of embodiments, thesensing circuitry 150 can comprise a number of sense amplifiers and anumber of compute components, which may comprise an accumulator and canbe used to perform logical operations (e.g., on data associated withcomplementary sense lines). In a number of embodiments, the sensingcircuitry (e.g., 150) can be used to perform division operations usingdata stored in array 130 as inputs and store the results of the divisionoperations back to the array 130 without transferring via a sense lineaddress access (e.g., without firing a column decode signal). As such, adivision operation can be performed using sensing circuitry 150 ratherthan and/or in addition to being performed by processing resourcesexternal to the sensing circuitry 150 (e.g., by a processor associatedwith host 110 and/or other processing circuitry, such as ALU circuitry,located on device 160 (e.g., on controller 140 or elsewhere)).

In various previous approaches, data associated with a divisionoperation, for instance, would be read from memory via sensing circuitryand provided to an external ALU. The external ALU circuitry wouldperform the division operations using the elements (which may bereferred to as operands or inputs) and the result could be transferredback to the array via the local I/O lines. In contrast, in a number ofembodiments of the present disclosure, sensing circuitry (e.g., 150) isconfigured to perform a division operation on data stored in memorycells in memory array 130 and store the result back to the array 130without enabling a local I/O line coupled to the sensing circuitry.

As such, in a number of embodiments, registers and/or an ALU external toarray 130 and sensing circuitry 150 may not be needed to perform thedivision operation as the sensing circuitry 150 can perform theappropriate computations involved in performing the division operationusing the address space of memory array 130. Additionally, the divisionoperation can be performed without the use of an external processingresource.

FIG. 2A illustrates a schematic diagram of a portion of a memory array230 including sensing circuitry 250 in accordance with a number ofembodiments of the present disclosure. In FIG. 2A, a memory cellcomprises a storage element (e.g., capacitor) and an access device(e.g., transistor). For instance, a first memory cell comprisestransistor 202-1 and capacitor 203-1, and a second memory cell comprisestransistor 202-2 and capacitor 203-2. In this example, the memory array230 is a DRAM array of 1T1C (one transistor one capacitor) memory cells;however, embodiments are not so limited. In a number of embodiments, thememory cells may be destructive read memory cells (e.g., reading thedata stored in the cell destroys the data such that the data originallystored in the cell is refreshed after being read). The cells of thememory array 230 are arranged in rows coupled by word lines 204-X (RowX), 204-Y (Row Y), etc., and columns coupled by pairs of complementarydata lines (e.g., DIGIT(n−1)/DIGIT(n−1)_, DIGIT(n)/DIGIT(n)_,DIGIT(n+1)/DIGIT(n+1)_). The individual data lines corresponding to eachpair of complementary data lines can also be referred to as data lines205-1 (D) and 205-2 (D_), respectively. Although only three pair ofcomplementary data lines are shown in FIG. 2A, embodiments of thepresent disclosure are not so limited, and an array of memory cells caninclude additional columns of memory cells and/or data lines (e.g.,4,096, 8,192, 16,384, etc.).

Memory cells can be coupled to different data lines and/or word lines.For example, a first source/drain region of a transistor 202-1 can becoupled to data line 205-1 (D), a second source/drain region oftransistor 202-1 can be coupled to capacitor 203-1, and a gate of atransistor 202-1 can be coupled to word line 204-Y. A first source/drainregion of a transistor 202-2 can be coupled to data line 205-2 (D_), asecond source/drain region of transistor 202-2 can be coupled tocapacitor 203-2, and a gate of a transistor 202-2 can be coupled to wordline 204-X. The cell plate, as shown in FIG. 2A, can be coupled to eachof capacitors 203-1 and 203-2. The cell plate can be a common node towhich a reference voltage (e.g., ground) can be applied in variousmemory array configurations.

The memory array 230 is coupled to sensing circuitry 250 in accordancewith a number of embodiments of the present disclosure. In this example,the sensing circuitry 250 comprises a sense amplifier 206 and a computecomponent 231 corresponding to respective columns of memory cells (e.g.,coupled to respective pairs of complementary data lines). The senseamplifier 206 can comprise a cross coupled latch, which can be referredto herein as a primary latch. The sense amplifier 206 can be configured,for example, as described with respect to FIG. 2B.

In the example illustrated in FIG. 2A, the circuitry corresponding tocompute component 231 comprises a static latch 264 and an additional tentransistors that implement, among other things, a dynamic latch. Thedynamic latch and/or static latch of the compute component 231 can becollectively referred to herein as a secondary latch, which can serve asan accumulator. As such, the compute component 231 can operate as and/orbe referred to herein as an accumulator. The compute component 231 canbe coupled to each of the data lines 205-1 (D) and 205-2 (D_) as shownin FIG. 2A. However, embodiments are not limited to this example. Thetransistors of compute component 231 can all be n-channel transistors(e.g., NMOS transistors); however, embodiments are not so limited.

In this example, data line 205-1 can be coupled to a first source/drainregion of transistors 216-1 and 239-1, as well as to a firstsource/drain region of load/pass transistor 218-1. Data line 205-2 canbe coupled to a first source/drain region of transistors 216-2 and239-2, as well as to a first source/drain region of load/pass transistor218-2.

The gates of load/pass transistor 218-1 and 218-2 can be commonlycoupled to a LOAD control signal, or respectively coupled to aPASSD/PASSDB control signal, as discussed further below. A secondsource/drain region of load/pass transistor 218-1 can be directlycoupled to the gates of transistors 216-1 and 239-2. A secondsource/drain region of load/pass transistor 218-2 can be directlycoupled to the gates of transistors 216-2 and 239-1.

A second source/drain region of transistor 216-1 can be directly coupledto a first source/drain region of pull-down transistor 214-1. A secondsource/drain region of transistor 239-1 can be directly coupled to afirst source/drain region of pull-down transistor 207-1. A secondsource/drain region of transistor 216-2 can be directly coupled to afirst source/drain region of pull-down transistor 214-2. A secondsource/drain region of transistor 239-2 can be directly coupled to afirst source/drain region of pull-down transistor 207-2. A secondsource/drain region of each of pull-down transistors 207-1, 207-2,214-1, and 214-2 can be commonly coupled together to a reference voltageline 291-1 (e.g., ground (GND)). A gate of pull-down transistor 207-1can be coupled to an AND control signal line, a gate of pull-downtransistor 214-1 can be coupled to an ANDinv control signal line 213-1,a gate of pull-down transistor 214-2 can be coupled to an ORinv controlsignal line 213-2, and a gate of pull-down transistor 207-2 can becoupled to an OR control signal line.

The gate of transistor 239-1 can be referred to as node S1, and the gateof transistor 239-2 can be referred to as node S2. The circuit shown inFIG. 2A stores accumulator data dynamically on nodes S1 and S2.Activating the LOAD control signal causes load/pass transistors 218-1and 218-2 to conduct, and thereby load complementary data onto nodes S1and S2. The LOAD control signal can be elevated to a voltage greaterthan V_(DD) to pass a full V_(DD) level to S1/S2. However, elevating theLOAD control signal to a voltage greater than V_(DD) is optional, andfunctionality of the circuit shown in FIG. 2A is not contingent on theLOAD control signal being elevated to a voltage greater than V_(DD).

The configuration of compute component 231 shown in FIG. 2A has thebenefit of balancing the sense amplifier for functionality when thepull-down transistors 207-1, 207-2, 214-1, and 214-2 are conductingbefore the sense amplifier 206 is fired (e.g., during pre-seeding of thesense amplifier 206). As used herein, firing the sense amplifier 206refers to enabling the sense amplifier 206 to set the primary latch andsubsequently disabling the sense amplifier 206 to retain the set primarylatch. Performing logical operations after equilibration is disabled (inthe sense amp), but before the sense amplifier fires, can save powerusage because the latch of the sense amplifier does not have to be“flipped” using full rail voltages (e.g., V_(DD), GND).

Inverting transistors can pull-down a respective data line in performingcertain logical operations. For example, transistor 216-1 (having a gatecoupled to S2 of the dynamic latch) in series with transistor 214-1(having a gate coupled to an ANDinv control signal line 213-1) can beoperated to pull-down data line 205-1 (D), and transistor 216-2 (havinga gate coupled to S1 of the dynamic latch) in series with transistor214-2 (having a gate coupled to an ANDinv control signal line 213-2) canbe operated to pull-down data line 205-2 (D).

The latch 264 can be controllably enabled by coupling to an activenegative control signal line 212-1 (ACCUMB) and an active positivecontrol signal line 212-2 (ACCUM) rather than be configured to becontinuously enabled by coupling to ground and V_(DD). In variousembodiments, load/pass transistors 208-1 and 208-2 can each having agate coupled to one of a LOAD control signal or a PASSD/PASSDB controlsignal.

According to some embodiments, the gate of load/pass transistor 218-1can be coupled to a PASSD control signal, and the gate of load/passtransistor 218-2 can be coupled to a PASSDb control signal. In theconfiguration in which the gates of transistors 218-1 and 218-2 arerespectively coupled to one of the PASSD and PASSDb control signals,transistors 218-1 and 218-2 can be pass transistors. Pass transistorscan be operated differently (e.g., at different times and/or underdifferent voltage/current conditions) than load transistors. As such,the configuration of pass transistors can be different than theconfiguration of load transistors.

For instance, load transistors can be constructed to handle loadingassociated with coupling data lines to the local dynamic nodes S1 andS2, and pass transistors can be constructed to handle heavier loadingassociated with coupling data lines to an adjacent accumulator (e.g.,through the shift circuitry 223, as shown in FIG. 2A). According to someembodiments, load/pass transistors 218-1 and 218-2 can be configured toaccommodate the heavier loading corresponding to a pass transistor butbe coupled and operated as a load transistor. Load/pass transistors218-1 and 218-2 configured as pass transistors can also be utilized asload transistors. However, load/pass transistors 218-1 and 218-2configured as load transistors may not be capable of being utilized aspass transistors.

In a number of embodiments, the compute component 231, including thelatch 264, can comprise a number of transistors formed on pitch with thetransistors of the corresponding memory cells of an array (e.g., array230 shown in FIG. 2A) to which they are coupled, which may conform to aparticular feature size (e.g., 4 F², 6 F², etc.). According to variousembodiments, latch 264 includes four transistors 208-1, 208-2, 209-1,and 209-2 coupled to a pair of complementary data lines 205-1 and 205-2through load/pass transistors 218-1 and 218-2. However, embodiments arenot limited to this configuration. The latch 264 can be a cross coupledlatch (e.g., gates of a pair of transistors, such as n-channeltransistors (e.g., NMOS transistors) 209-1 and 209-2 are cross coupledwith the gates of another pair of transistors, such as p-channeltransistors (e.g., PMOS transistors) 208-1 and 208-2). As describedfurther herein, the cross coupled latch 264 can be referred to as astatic latch.

The voltages or currents on the respective data lines 205-1 and 205-2can be provided to the respective latch inputs 217-1 and 217-2 of thecross coupled latch 264 (e.g., the input of the secondary latch). Inthis example, the latch input 217-1 is coupled to a first source/drainregion of transistors 208-1 and 209-1 as well as to the gates oftransistors 208-2 and 209-2. Similarly, the latch input 217-2 can becoupled to a first source/drain region of transistors 208-2 and 209-2 aswell as to the gates of transistors 208-1 and 209-1.

In this example, a second source/drain region of transistor 209-1 and209-2 is commonly coupled to a negative control signal line 212-1 (e.g.,ground (GND) or ACCUMB control signal similar to control signal RnIFshown in FIG. 2B with respect to the primary latch). A secondsource/drain region of transistors 208-1 and 208-2 is commonly coupledto a positive control signal line 212-2 (e.g., V_(DD) or ACCUM controlsignal similar to control signal ACT shown in FIG. 2B with respect tothe primary latch). The positive control signal 212-2 can provide asupply voltage (e.g., V_(DD)) and the negative control signal 212-1 canbe a reference voltage (e.g., ground) to enable the cross coupled latch264. According to some embodiments, the second source/drain region oftransistors 208-1 and 208-2 are commonly coupled directly to the supplyvoltage (e.g., V_(DD)), and the second source/drain region of transistor209-1 and 209-2 are commonly coupled directly to the reference voltage(e.g., ground) so as to continuously enable latch 264.

The enabled cross coupled latch 264 operates to amplify a differentialvoltage between latch input 217-1 (e.g., first common node) and latchinput 217-2 (e.g., second common node) such that latch input 217-1 isdriven to either the activated positive control signal voltage (e.g.,V_(DD)) or the activated negative control signal voltage (e.g., ground),and latch input 217-2 is driven to the complementary (e.g., other) ofthe activated positive control signal voltage (e.g., V_(DD)) or theactivated negative control signal voltage (e.g., ground).

FIG. 2B illustrates a schematic diagram of a portion of a memory arrayin accordance with a number of embodiments of the present disclosure.According to various embodiments, sense amplifier 206 can comprise across coupled latch. However, embodiments of the sense amplifier 206 arenot limited to a cross coupled latch. As an example, the sense amplifier206 can be current-mode sense amplifier and/or single-ended senseamplifier (e.g., sense amplifier coupled to one data line). Also,embodiments of the present disclosure are not limited to a folded dataline architecture.

In a number of embodiments, a sense amplifier (e.g., 206) can comprise anumber of transistors formed on pitch with the transistors of thecorresponding compute component 231 and/or the memory cells of an array(e.g., 230 shown in FIG. 2A) to which they are coupled, which mayconform to a particular feature size (e.g., 4 F², 6 F², etc.). The senseamplifier 206 comprises a latch 215 including four transistors coupledto a pair of complementary data lines 205-1 and 205-2. The latch 215 canbe a cross coupled latch (e.g., gates of a pair of transistors, such asn-channel transistors (e.g., NMOS transistors) 227-1 and 227-2 are crosscoupled with the gates of another pair of transistors, such as p-channeltransistors (e.g., PMOS transistors) 229-1 and 229-2). As describedfurther herein, the latch 215 comprising transistors 227-1, 227-2,229-1, and 229-2 can be referred to as a primary latch. However,embodiments are not limited to this example.

The voltages and/or currents on the respective data lines D and D_ canbe provided to the respective latch inputs 233-1 and 233-2 of the crosscoupled latch 215 (e.g., the input of the secondary latch). In thisexample, the latch input 233-1 is coupled to a first source/drain regionof transistors 227-1 and 229-1 as well as to the gates of transistors227-2 and 229-2. Similarly, the latch input 233-2 can be coupled to afirst source/drain region of transistors 227-2 and 229-2 as well as tothe gates of transistors 227-1 and 229-1. The compute component 233(e.g., accumulator) can be coupled to latch inputs 233-1 and 233-2 ofthe cross coupled latch 215 as shown; however, embodiments are notlimited to the example shown in FIG. 2B.

In this example, a second source/drain region of transistor 227-1 and227-2 is commonly coupled to an active negative control signal 228(RnIF). A second source/drain region of transistors 229-1 and 229-2 iscommonly coupled to an active positive control signal 265 (ACT). The ACTsignal 265 can be a supply voltage (e.g., V_(DD)) and the RnIF signalcan be a reference voltage (e.g., ground). Activating signals 228 and265 enables the cross coupled latch 215.

The enabled cross coupled latch 215 operates to amplify a differentialvoltage between latch input 233-1 (e.g., first common node) and latchinput 233-2 (e.g., second common node) such that latch input 233-1 isdriven to one of the ACT signal voltage and the RnIF signal voltage(e.g., to one of V_(DD) and ground), and latch input 233-2 is driven tothe other of the ACT signal voltage and the RnIF signal voltage.

The sense amplifier 206 can also include circuitry configured toequilibrate the data lines 205-1 and 205-2 (e.g., in association withpreparing the sense amplifier for a sensing operation). In this example,the equilibration circuitry comprises a transistor 224 having a firstsource/drain region coupled to a first source/drain region of transistor225-1 and data line 205-1. A second source/drain region of transistor224 can be coupled to a first source/drain region of transistor 225-2and data line 205-2. A gate of transistor 224 can be coupled to gates oftransistors 225-1 and 225-2.

The second source drain regions of transistors 225-1 and 225-2 arecoupled to an equilibration voltage 238 (e.g., V_(DD)/2), which can beequal to V_(DD)/2, where V_(DD) is a supply voltage associated with thearray. The gates of transistors 224, 225-1, and 225-2 can be coupled tocontrol signal 225 (EQ). As such, activating EQ enables the transistors224, 225-1, and 225-2, which effectively shorts data line 205-1 to dataline 205-2 such that the data lines 205-1 and 205-2 are equilibrated toequilibration voltage V_(DD)/2. According to various embodiments of thepresent disclosure, a number of logical operations can be performedusing the sense amplifier, and storing the result in the computecomponent (e.g., accumulator).

As shown in FIG. 2A, the sense amplifier 206 and the compute component231 can be coupled to the array 230 via shift circuitry 223. In thisexample, the shift circuitry 223 comprises a pair of isolation devices(e.g., isolation transistors 221-1 and 221-2) coupled to data lines205-1 and 205-2, respectively). The isolation transistors 221-1 and221-2 are coupled to a control signal 222 (NORM) that, when activated,enables (e.g., turns on) the isolation transistors 221-1 and 221-2 tocouple the corresponding sense amplifier 206 and compute component 231to a corresponding column of memory cells (e.g., to a corresponding pairof complementary data lines 205-1 and 205-2). According to variousembodiments, conduction of isolation transistors 221-1 and 221-2 can bereferred to as a “normal” configuration of the shift circuitry 223.

In the example illustrated in FIG. 2A, the shift circuitry 223 includesanother (e.g., a second) pair of isolation devices (e.g., isolationtransistors 221-3 and 221-4) coupled to a complementary control signal219 (SHIFT), which can be activated, for example, when NORM isdeactivated. The isolation transistors 221-3 and 221-4 can be operated(e.g., via control signal 219) such that a particular sense amplifier206 and compute component 231 are coupled to a different pair ofcomplementary data lines (e.g., a pair of complementary data linesdifferent than the pair of complementary data lines to which isolationtransistors 221-1 and 221-2 couple the particular sense amplifier 206and compute component 231), or can couple a particular sense amplifier206 and compute component 231 to another memory array (and isolate theparticular sense amplifier 206 and compute component 231 from a firstmemory array). According to various embodiments, the shift circuitry 223can be arranged as a portion of (e.g., within) the sense amplifier 206,for instance.

Although the shift circuitry 223 shown in FIG. 2A includes isolationtransistors 221-1 and 221-2 used to couple particular sensing circuitry250 (e.g., a particular sense amplifier 206 and corresponding computecomponent 231) to a particular pair of complementary data lines 205-1and 205-2 (e.g., DIGIT(n) and DIGIT(n)_) and isolation transistors 221-3and 221-4 are arranged to couple the particular sensing circuitry 250 toan adjacent pair of complementary data lines in one particular direction(e.g., adjacent data lines DIGIT(n+1) and DIGIT(n+1)_ shown to the rightin FIG. 2A), embodiments of the present disclosure are not so limited.For instance, shift circuitry can include isolation transistors 221-1and 221-2 used to couple particular sensing circuitry to a particularpair of complementary data lines (e.g., DIGIT(n) and DIGIT(n)_ andisolation transistors 221-3 and 221-4 arranged so as to be used tocouple the particular sensing circuitry to an adjacent pair ofcomplementary data lines in another particular direction (e.g., adjacentdata lines DIGIT(n−1) and DIGIT(n−1)_ shown to the left in FIG. 2A).

Embodiments of the present disclosure are not limited to theconfiguration of shift circuitry 223 shown in FIG. 2A. In a number ofembodiments, shift circuitry 223 such as that shown in FIG. 2A can beoperated (e.g., in conjunction with sense amplifiers 206 and computecomponents 231) in association with performing various operations (e.g.,logical and/or arithmetic operations) without transferring data out ofthe sensing circuitry 250 via an I/O line (e.g., I/O line 334 shown inFIG. 3), for instance. Although shift circuitry 223 is shown to beseparate from sensing circuitry 250 (e.g., sensing circuitry 150 in FIG.1), shift circuitry 223 can be considered to be part of sensingcircuitry 250 (e.g., sensing circuitry 150 in FIG. 1).

Although not shown in FIG. 2A, each column of memory cells can becoupled to a column decode line (e.g., decode lines 310-0 to 310-W shownin FIG. 3) that can be activated to transfer, via local I/O line (e.g.,I/O line 334 shown in FIG. 3), a data value from a corresponding senseamplifier 206 and/or compute component 231 to a control componentexternal to the array such as an external processing resource (e.g.,host processor and/or other functional unit circuitry). The columndecode line can be coupled to a column decoder (e.g., column decoder 152shown in FIG. 1). However, as described herein, in a number ofembodiments, data need not be transferred via such I/O lines to performlogical operations in accordance with embodiments of the presentdisclosure. In a number of embodiments, shift circuitry 223 can beoperated in conjunction with sense amplifiers 206 and compute components231 to perform various operations (e.g., logical operations inassociation with performing subtraction, addition, multiplication,division, etc.) without transferring data to a control componentexternal to the array, for instance.

The sensing circuitry 250 can be operated in several modes to performlogical operations, including a second mode in which a result of thelogical operation is initially stored in the sense amplifier 206, and afirst mode in which a result of the logical operation is initiallystored in the compute component 231. Operation of the sensing circuitry250 in the second mode is described below with respect to FIGS. 5 and 6,and operation of the sensing circuitry 250 in the second mode isdescribed below with respect to FIGS. 7-10. Additionally, with respectto the first operating mode, sensing circuitry 250 can be operated inboth pre-sensing (e.g., sense amps fired before logical operationcontrol signal active) and post-sensing (e.g., sense amps fired afterlogical operation control signal active) modes with a result of alogical operation being initially stored in the sense amplifier 206.

As described further below, the sense amplifier 206 can, in conjunctionwith the compute component 231, be operated to perform various logicaloperations using data from an array as input. In a number ofembodiments, the result of a logical operation can be stored back to thearray without transferring the data via a data line address access(e.g., without firing a column decode signal such that data istransferred to circuitry external from the array and sensing circuitryvia local I/O lines). As such, a number of embodiments of the presentdisclosure can enable performing logical operations using less powerthan various previous approaches. Additionally, since a number ofembodiments eliminate the need to transfer data across I/O lines (e.g.,between memory and discrete processor) in order to perform variousoperations (e.g., compute functions, a number of embodiments can enablean increased parallel processing capability as compared to previousapproaches.

FIG. 3 illustrates a schematic diagram of a portion of a memory array330 in accordance with a number of embodiments of the presentdisclosure. The array 330 includes memory cells 303-0, 303-1, 303-3,303-4, 303-5, 303-6, 303-7, 303-8, . . . , 303-J (e.g., referred togenerally as memory cells 303), coupled to rows of access lines 304-0,304-1, 304-2, 304-3, 304-4, 304-5, 304-6, . . . , 304-R and columns ofsense lines 305-0, 305-1, 305-2, 305-3, 305-4, 305-5, 305-6, 305-7, . .. , 305-S, which may be referred to generally as access lines 304 andsense lines 305. Memory array 330 is not limited to a particular numberof access lines and/or sense lines, and use of the terms “rows” and“columns” does not intend a particular physical structure and/ororientation of the access lines and/or sense lines. Although notpictured, each column of memory cells can be associated with acorresponding pair of complementary sense lines (e.g., complementarysense lines 205-1 and 205-2 in FIG. 2A).

Each column of memory cells can be coupled to sensing circuitry (e.g.,sensing circuitry 150 shown in FIG. 1 and sensing circuitry 250 shown inFIG. 2A). In this example, the sensing circuitry comprises a number ofsense amplifiers 306-0, 306-1, 306-2, 306-3, 306-4, 306-5, 306-6, 306-7,. . . , 306-U (e.g., referred to generally as sense amplifiers 306)coupled to the respective sense lines 305-0, 305-1, 305-2, 305-3, 305-4,305-5, 305-6, 305-7, . . . , 305-S. The sense amplifiers 306 are coupledto input/output (I/O) line 334 (e.g., a local I/O line) via accessdevices (e.g., transistors) 308-0, 308-2, 308-3, 308-4, 308-5, 308-6,308-7, . . . , 308-V. In this example, the sensing circuitry alsocomprises a number of compute components 331-0, 331-2, 331-3, 331-4,331-5, 331-6, 331-7, . . . , 331-X (e.g., referred to generally ascompute components 331) coupled to the respective sense lines. Columndecode lines 310-0 to 310-W are coupled to the gates of transistors308-0 to 308-V, respectively, and can be selectively activated totransfer data sensed by respective sense amplifiers 306-0 to 306-Uand/or stored in respective compute components 331-0 to 331-X to asecondary sense amplifier 312 and/or to processing resources external toarray 330 (e.g., via I/O line 334). In a number of embodiments, thecompute components 331 can be formed on pitch with the memory cells oftheir corresponding columns and/or with the corresponding senseamplifiers 306.

The sensing circuitry (e.g., compute components 331 and sense amplifiers306) is configured to perform a division operation in accordance with anumber of embodiments described herein. The example given in FIGS. 4A to4F demonstrates how a division operation can be performed using datastored in array 330 as the inputs. The example involves using theelements (e.g., operands comprising bits corresponding to logic “1” orlogic “0”) stored in the memory cells coupled to access lines 304-0 to304-R and commonly coupled to sense lines 305-0 to 305-S as therespective inputs to the division operation. The result of the divisionoperation can be stored in array 330 and/or can be transferred externalto the array 330 (e.g., to functional unit circuitry of a host).

FIG. 4A illustrates a table showing the states of memory cells of anarray at a number of particular phases associated with performing adivision operation in accordance with a number of embodiments of thepresent disclosure. Column 496 of the table provides reference numbers(e.g., 1-8) for the rows of the table, and the reference numbers shownin the table correspond to the respective reference numbers of thepseudocode described below. The bit-vector values for each of thebit-vectors 476 (Dynamic_Mask), 478 (Static_Mask), 480(Current_Dividend), 482 (Current_Compare), 488 (Dividend), 490(Divisor), 492 (Quotient), and 494 (Remainder) are stored in the arrayat various division operation phases corresponding to reference numbers1-8.

The bit-vectors 476, 478, 480, 482 can be stored in respective groups ofmemory cells coupled to particular access lines, which may be referredto as temporary storage rows 470 (e.g., rows that store data that may beupdated during various phases of a division operation). The bit-vectors488, 490, 492, and 494 can be referred to as vector arguments 472. FIG.4A also indicate the bit-vector values for a bit-vector 431 (Comp_Comp)stored in compute components (e.g., 331 shown in FIG. 3) of the array.

In FIG. 4A the values of the bit-vectors corresponding to the temporarystorage rows 470 and/or the vector arguments 472 are shown inhexadecimal format although the corresponding bit-vectors operated onduring the division operation can be stored as binary bit patterns inthe array. For example, a Dividend bit-vector 488 (e.g., [0111, 0111,0100, 0100, 1000, 1000, 1100, 1100] can be represented as [7, 7, 4, 4,8, 8, c, c] in hexadecimal format. The values shown in FIGS. 4A to 4Fare shown in hexadecimal format for ease of reference.

In the examples used herein, bit-vector values may include commas and/orspaces for ease of reference. For instance, a bit-vector represented inhexadecimal notation as [7, 7, 4, 4, 8, 8, c, c] can correspond to eight4-bit wide vector elements, with the eight elements separated by arespective comma and space. However, the same bit-vector can berepresented as [7 7 4 4 8 8 c c] (e.g., without commas) and/or as[774488cc] (e.g., without commas and without spaces).

In FIGS. 4A to 4F changes to the bit-vectors corresponding to Comp_Comp431, the bit-vectors corresponding to the temporary storage rows 470(e.g., Dynamic_Mask 476, Static_Mask 478, Current_Dividend 480, andCurrent_Compare 482), and the bit-vectors corresponding to vectorarguments 472 (e.g., Dividend 488, Divisor 490, Quotient 492, andRemainder 494) are indicated in bold font. For example, at reference 1,Dividend 488, Divisor 490, Quotient 492, and Remainder 494 are shown inbold font indicating values of the respective bit-vectors have changedduring an operation phase to which the reference number corresponds.

In the example shown in FIGS. 4A to 4F, each of Dividend 488 (e.g., abit-vector [774488cc]) and Divisor 490 (e.g., a bit-vector [33552233])comprise eight elements and are associated with eight separate divisionoperations. Each of the eight separate division operations can beperformed in parallel. Performing a number of division operations inparallel includes performing the number of division operation in singleinstruction multiple data (SIMD) fashion. As used herein, SIMD isdefined as performing a same operation on multiple elementssimultaneously.

For example, a first division operation can include dividing a firstelement (e.g., 7) of Dividend 488 by a first element (e.g., 3) ofDivisor 490. That is, a first division operation can be performed on afirst element pair that includes the first dividend element fromDividend 488 and the first divisor element from Divisor 490. A seconddivision operation can be performed on a second element pair thatincludes the second dividend element (e.g., 7) from Dividend 488 and thesecond divisor element (e.g., 3) from Divisor 490. A third divisionoperation can be performed on a third element pair that includes thethird dividend element (e.g., 4) from Dividend 488 and the third divisorelement (e.g., 5) from Divisor 490. A fourth division operation can beperformed on a fourth element pair that includes the fourth dividendelement (e.g., 4) from Dividend 488 and the fourth divisor element(e.g., 5) from Divisor 490. A fifth division operation can be performedon a fifth element pair that includes the fifth dividend element (e.g.,8) from Dividend 488 and the fifth divisor element (e.g., 2) fromDivisor 490. A sixth division operation can be performed on a sixthelement pair that includes the sixth dividend element (e.g., 8) fromDividend 488 and the sixth divisor element (e.g., 2) from Divisor 490. Aseventh division operation can be performed on a seventh element pairthat includes the seventh dividend element (e.g., c) from Dividend 488and the seventh divisor element (e.g., 3) from Divisor 490. An eighthdivision operation can be performed on an eighth element pair thatincludes the eighth dividend element (e.g., c) from Dividend 488 and theeighth divisor element (e.g., 3) from Divisor 490.

A first group of memory cells that store Dividend 488 can be cellscoupled to a particular access line (e.g., 304-0 in FIG. 3) and to anumber of sense lines (e.g., 305-0 to 305-31 in FIG. 3). The secondgroup of memory cells that store Divisor 490 can be cells coupled to adifferent particular access line (e.g., 304-1 in FIG. 3) and to a numberof sense lines (e.g., 305-0 to 305-31 in FIG. 3).

The eight elements of Dividend 488 can be stored in the first group ofmemory cells. For example, a first element (e.g., 7) of Dividend 488 canbe stored in memory cells that are coupled to access line 304-0 andsense lines 305-0 to 305-3 in FIG. 3, a second element (e.g., 7) ofDividend 488 can be stored in memory cells that are coupled to accessline 304-0 and sense lines 305-4 to 305-7 in FIG. 3, a third element(e.g., 4) of Dividend 488 can be stored in memory cells that are coupledto access line 304-0 and sense lines 305-8 to 305-11 in FIG. 3, a fourthelement (e.g., 4) of Dividend 488 can be stored in memory cells that arecoupled to access line 304-0 and sense lines 305-12 to 305-15 in FIG. 3,a fifth element (e.g., 8) of Dividend 488 can be stored in memory cellsthat are coupled to access line 304-0 and sense lines 305-16 to 305-19in FIG. 3, a sixth element (e.g., 8) of Dividend 488 can be stored inmemory cells that are coupled to access line 304-0 and sense lines305-20 to 305-23 in FIG. 3, a seventh element (e.g., c) of Dividend 488can be stored in memory cells that are coupled to access line 304-0 andsense lines 305-24 to 305-27 in FIG. 3, an eight element (e.g., c) ofDividend 488 can be stored in memory cells that are coupled to accessline 304-0 and sense lines 305-28 to 305-31 in FIG. 3.

The eight elements of Divisor 490 can be stored in the second group ofmemory cells. For example, a first element (e.g., 3) of Divisor 490 canbe stored in memory cells that are coupled to access line 304-1 andsense lines 305-0 to 305-3 in FIG. 3, a second element (e.g., 3) ofDivisor 490 can be stored in memory cells that are coupled to accessline 304-1 and sense lines 305-4 to 305-7 in FIG. 3, a third element(e.g., 5) of Divisor 490 can be stored in memory cells that are coupledto access line 304-1 and sense lines 305-8 to 305-11 in FIG. 3, a fourthelement (e.g., 5) of Divisor 490 can be stored in memory cells that arecoupled to access line 304-1 and sense lines 305-12 to 305-15 in FIG. 3,a fifth element (e.g., 2) of Divisor 490 can be stored in memory cellsthat are coupled to access line 304-1 and sense lines 305-16 to 305-19in FIG. 3, a sixth element (e.g., 2) of Divisor 490 can be stored inmemory cells that are coupled to access line 304-1 and sense lines305-20 to 305-23 in FIG. 3, a seventh element (e.g., 3) of Divisor 490can be stored in memory cells that are coupled to access line 304-1 andsense lines 305-24 to 305-27 in FIG. 3, an eight element (e.g., 3) ofDivisor 490 can be stored in memory cells that are coupled to accessline 304-1 and sense lines 305-28 to 305-31 in FIG. 3.

Dynamic_Mask 476, Static_Mask 478, Current_Dividend 480, andCurrent_Compare 483 include bit-vectors that are stored in a pluralityof groups of memory cells. For instance, Dynamic_Mask 476, Static_Mask478, Current_Dividend 480, and Current_Compare 483 can be stored inmemory cells that are coupled to respective access lines 304-2 to 304-5and to sense lines 305-0 to 305-31.

In this example, the first element in Dividend 488 has a decimal valueof 7, which can be represented by binary bit-vector [0111]. Theparticular bits of the bit-vector can be stored in the cells coupled toaccess line 304-0 and to the corresponding respective sense lines 305-0to 305-3 (e.g., the most significant bit (MSB) of the bit-vector can bestored in the ROW 0 cell coupled to sense line 305-0, the next leastsignificant bit (LSB) can be stored in the ROW 0 cell coupled to senseline 305-1, . . . , and the LSB can be stored in the ROW 0 cell coupledto sense line 305-3) in FIG. 3. Similarly, the first element in Divisor490 has a decimal value of 3, which can be represented by binarybit-vector [0011], and the particular bits of the bit-vector can bestored in the cells coupled to access line 304-1 and to thecorresponding respective sense lines 305-0 to 305-3. As such, therespective bits of the 4-bit wide bit-vectors representing the firstelement in Dividend 488 and the first element in Divisor 490 can bestored in cells coupled to respective same sense lines. That is, in thisexample, the MSBs of the bit-vectors are stored in cells coupled tosense line 305-0, the next least significant bits of the bit-vectors arestored in cells coupled to sense line, 305-1, etc.

In a number of examples, the MSB of the bit-vectors can be stored in theROW 0 cell coupled to sense line 305-3, the next LSB can be stored inthe ROW 0 cell coupled to sense line 305-2, . . . , and the LSB can bestored in the ROW 0 cell coupled to sense line 305-0. That is, the MSBsof the bit-vectors are stored in cells coupled to sense line 305-3, thenext least significant bits of the bit-vectors are stored in cellscoupled to sense line, 305-2, etc.

However, embodiments are not limited to this example. For instance,elements to be divided in accordance with embodiments described hereincan be represented by bit-vectors having a width other than 4-bits. Forinstance, a 64-bit wide dividend bit-vector could represent fourelements each represented by a 16-bit wide bit-vector and could bestored in cells coupled to access line 304-0 (and to sense lines 305-0to 305-63), and a 64-bit wide divisor bit-vector could represent fourelements each represented by a 16-bit wide bit vector and could bestored in cells coupled to access line 304-1 (and to sense lines 305-0to 305-63). The four elements represented by the 64-bit wide dividendbit-vector can be divided by the respective four elements represented bythe 64-bit wide divisor bit-vector in accordance with embodimentsdescribed herein.

In a number of embodiments, the result of a division operation can bestored in a third group of memory cells, which can be cells coupled to anumber of particular access lines (e.g., 304-0 to 304-R in FIG. 3). Thethird group of memory cells can be used to store a quotient bit-vectorand/or a remainder bit-vector that indicates the result of the divisionoperation. The third group of memory cells can, for example, be cellscoupled to an access line 304-6 and/or access line 304-7 and/or cellscoupled to at least one of access line 304-0 and access line 304-1. Thatis, the third group of memory cells can be a same group of memory cellsas the first group of memory cells (e.g., the group of memory cellsstoring the dividend bit-vector) and/or the second group of memory cells(e.g., the group of memory cells storing the divisor bit-vector). Forinstance, in the 4-bit wide bit-vector example above, the third group ofmemory cells can be cells coupled to access line 304-0 and to senselines 305-0 to 305-31 and/or cells coupled to access line 304-1 and tosense lines 305-0 to 305-31.

As an example, the first quotient element in Quotient 492 can be storedin the cells coupled to access line 304-6 and to sense lines 305-0 to305-3 as shown in FIG. 3. The first remainder element in Remainder 494can be stored in the cells coupled to access line 304-7 and to the senselines 305-0 to 305-3, for instance. In a number of examples, the firstquotient element and/or the first remainder element can be stored incells coupled to an access line to which cells storing the firstdividend element from Dividend 488 and/or first divisor element fromdivisor 490 are coupled. For instance, if a dividend element is storedin a first group of cells coupled to access line 304-0 and a divisorelement is stored in a second group of cells coupled to access line304-1, a third group of cells storing the quotient element and/or theremainder element may comprise cells coupled to access lines 304-0 and304-1 in FIG. 3, respectively.

The third group of memory cells can also comprise a first number ofmemory cells coupled to a particular access line and a second number ofmemory cells coupled to a different particular access line. The firstand second numbers of memory cells can store two different bit-vectorsthat together indicate the results of the division operation. Forexample, a quotient bit-vector can be stored in the first number ofmemory cells and a remainder bit-vector can be stored in the secondnumber of memory cells.

As described further below, dividing the first element (e.g., 7) ofDividend 488 by the first element (e.g., 3) of Divisor 490, results inthe first element in Quotient 492 having a value equal to 2 and thefirst element in Remainder 494 having a value equal to 1 (e.g., 7divided by 3 equals 2 with a remainder of 1).

In a number of examples, performing a division operation on a dividendelement and a divisor element can include performing a number of ANDoperations, OR operations, SHIFT operations, and INVERT operationswithout transferring data via an input/output (I/O) line. The number ofAND operations, OR operations, INVERT operations, and SHIFT operationscan be performed using sensing circuitry on pitch with memory cellscorresponding to respective columns of complementary sense lines. In anumber of examples, the number of AND operations, OR operations, SHIFToperations, and INVERT operations can be performed to divide a number ofdividend elements by a number of divisor elements in parallel.Performing operations (e.g., AND, OR, INVERT, SHIFT) in association withperforming a number of division operations in memory is describedfurther below in association with FIGS. 5-10.

The below pseudocode represents instructions executable to perform anumber of division operations in a memory in accordance with a number ofembodiments of the present disclosure. The example pseudocode isreferenced using reference numbers 1-8, which correspond to therespective reference numbers 1-8 shown in column 496 of the table shownin FIGS. 4A to 4F. For example, reference number one (1) corresponds to“Load Dividend, Divisor” in the pseudocode, and reference number two (2)corresponds to “Find out element count in sub array for the vectorwidth” in the pseudocode.

1. Load Dividend, Divisor.

2. Find out element count in sub array for the vector width.

3. Obtain all Temp Rows.

4. Find MSB and store in Comp_Comp, Static_Mask.5. Find MSB by shifting right with fixed vector for each vector width inComp_Comp, Static_Mask.

6. Store in Dynamic_Mask.

7. For given Vector Fixed width:

-   -   a. Load Dynamic_Mask in Comp_Comp.    -   b. Store in Current_Dividend.    -   c. Loop for current position in element.        -   i. Shift Right.        -   ii. Perform OR with Static_Mask.        -   iii. Store in Current_Dividend.    -   d. Perform AND operation with Dividend.    -   e. Store Comp_Comp in Current_Dividend.    -   f. Shift Right from current position to the beginning of Vector.    -   g. Perform OR with Remainder.    -   h. Store in Current_Dividend    -   i. Store in Remainder    -   j. Horizontal compare Current_Dividend with Divisor get greater        than mask in Current_Compare.    -   k. Shift right Dynamic_Mask by applying Current_Compare.    -   l. Load inverse of Current_Compare into Comp_Comp.    -   m. Perform AND operation with Remainder.    -   n. Store in Row_Current_Dividend.    -   o. Using Current_Compare mask get difference from remainder and        Divisor into Current_Dividend.    -   p. Load Quotient in Comp_Comp.    -   q. Shift left, store in Quotient.    -   r. Using Current_Compare mask add to Quotient a true bit at the        end of each fixed Vector.    -   s. Load Current_Dividend in Comp_Comp.    -   t. Shift Left    -   u. Store Comp_Comp in Current_Dividend and Remainder.    -   v. Load Dynamic_Mask in Comp_Comp.    -   w. Shift Comp_Comp right applying mask in Current_Compare.    -   x. Store Comp_Comp in Dynamic_Mask.

8. Right Shift Remainder.

For purposes of discussion, the above pseudocode will be divided into asetup phase, a division phase, and a shift phase. The pseudocodereferenced by reference numbers 1-6 and FIG. 4A can correspond to thesetup phase. FIG. 4A illustrates the values of a number of bit-vectorsassociated with performing a division operation after the setup phase.The pseudocode referenced by reference numbers 7 a-7 x and FIGS. 4B to4E can correspond to the division phase. FIGS. 4B to 4E illustrate thevalues of a number of bit-vectors associated with performing a divisionoperation after the division phase. The pseudocode referenced byreference number 8 and FIG. 4F can correspond to the shift phase. FIG.4F illustrates the values of a number of bit-vectors associated withperforming a division operation after the shift phase.

In a number of examples, the results of the division operation can bestored in an array (e.g., array 330 in FIG. 3) without transferring datavia an I/O line (e.g., I/O line 334). In a number of examples, theresults of the division operation can be transferred to a location otherthan array 330 in FIG. 3.

The pseudocode corresponding to reference number 1 (e.g., Load Dividend,Divisor) is associated with storing Dividend 488 and Divisor 490 intothe array 330 in FIG. 3. As described above, Dividend 488 and Divisor490 can each include a number of elements. At reference number 1, thebit-vector [774488cc] is stored in a group of memory cells that storeDividend 488, the bit-vector [33552233] is stored in a group of memorycells that store Divisor 490, the bit-vector [00000000] is stored in agroup of memory cells that store Quotient 492 and is stored in a groupof memory cells that store Remainder 494.

As used herein, Dynamic_Mask 476 can be used to coordinate performinglogical operations associated with a division operation. The Static_Mask478 can be used to define boundaries of elements in Dividend 488 andDivisor 490 (e.g., bit positions at which the respective elements beginand/or end). Static_Mask 478 can also be used to set Dynamic_Mask 476.An example of setting the Dynamic_Mask 476 using the Static_Mask 478 isgiven in the operations performed in association with reference number6. The Current_Dividend 480 can be used to represent the sum of theremainder and the dividend. The Current_Compare 482 can be used to storea mask that is the result of a comparison operation.

The groups of memory cells corresponding to temporary storage rows 470(e.g., the rows storing bit-vectors 476, 478, 480, and 482) may beoriented within memory 330 in a manner that facilitates performance ofthe division operation on the element pairs. For example, a plurality ofgroups of memory cells each storing the bit-vectors corresponding torespective temporary storage rows can be coupled to sense lines 305-0 to305-31 in FIG. 3. Each group in the plurality of groups of memory cellscan be coupled to a different access line (e.g., different access linesthan those having cells coupled thereto that are used to store thebit-vectors 488 and 490).

The pseudocode referenced at reference number 2 (e.g., Find out elementcount in sub array for the vector width) is associated with determiningthe quantity of elements in each of Dividend 488 and/or Divisor 490. Thequantity of elements can be determined based on an element width, forinstance. In a number of examples, the element width can be a knownand/or given quantity that may be provided by host and/or user (e.g.,the element width can be a predetermined quantity). For instance, inthis example in which the bit vectors 488 and 490 have a width of 32bits, the element count can be determined based on the know elementwidth of 4 bits. As such, the element count is 8 (e.g., 32 bits dividedby 4 bits/element equals 8 elements). Therefore, in this example,Dividend 488 and Divisor 490 each comprise 8 elements. Similarly, if theelement count is a known quantity (e.g., 8), then the element width canbe determined based on the width of bit-vectors 488 and 490 (e.g., 32bits divided by 8 elements equals 4 bits per element). The element countand element width can be used, for example, in performing iterations ofoperations (e.g., “for” loops) in association with performing divisionoperations as described below.

The pseudocode reference at reference numbers 4 to 5 can be performed tocreate a bit-vector that identifies the most significant bit (MSB) ineach of the elements in Dividend 488 and/or Divisor 490. Although eachof the elements have a same element width in this example, embodimentsare not so limited.

The pseudocode referenced at reference number 4 (e.g., Find MSB andstore in Comp_Comp, Static_Mask) is associated with determining the MSBin Dividend 488 and/or Divisor 490 and storing a bit-vector indicatingthe MSB in particular groups of memory cells. The bit pattern indicatingthe most significant bit can be stored (e.g., as a bit-vector) in agroup of memory cells used to store Static_Mask 476. The bit patternindicating the MSB can also be stored (e.g., as a latched bit-vector) insensing circuitry (e.g., compute components 331 and/or sense amplifiers306 in FIG. 3). As an example, a bit pattern comprising a “1” in a MSBposition and all “Os” in the remaining bit positions can be used toindicate the MSB of Dividend 488 and/or Divisor 490. For instance, inthis example, Dividend 488 and Divisor 490 are 32-bit wide bit-vectorsand can be stored in memory cells coupled to sense lines 305-0 to305-31, such that the 32-bit wide binary bit-vector [1000 0000 0000 00000000 0000 0000 0000] (e.g., hexadecimal bit-vector [80000000]) can beused as the bit-vector indicating the MSB in Dividend 488 and Divisor490. As such, as shown in FIG. 4A (e.g., at reference 4), the bit-vectorindicating the MSB (e.g., a bit-vector [1000 0000 0000 0000 0000 00000000 0000]) is stored in the group of memory cells storing bit-vector478 and is stored in the compute components storing bit-vector 431(e.g., bit-vectors 431 and 478 have a hexadecimal value [80000000]).

The pseudocode referenced at reference number 5 (e.g., Find MSB byshifting right with fixed vector for each vector width in Comp_Comp) isassociated with determining a bit-vector that can indicate a MSBcorresponding to each of a number of elements represented by Dividend488 and/or Divisor 490. The bit-vector used to indicate the MSBscorresponding to the number of elements can be determined by performinga number of logical operations (e.g., a number of iterations of SHIFToperations and OR operations) on the bit-vector stored in the computecomponents (e.g., 331-0 to 331-31 in FIG. 3). The SHIFT and ORiterations can result in a binary bit-vector [1000, 1000, 1000, 1000,1000, 1000, 1000, 1000] (e.g., the hexadecimal bit-vector [88888888])that comprises a “1” at the bit positions corresponding to the MSBs foreach of the eight elements represented by Dividend 488 and/or Divisor490. The SHIFT operations can be right SHIFT operations; however,embodiments are not limited to this example. The SHIFT operations can beperformed on Comp_Comp 431. The OR operations can be performed onStatic_Mask 478 and Comp_Comp 431. The results of the SHIFT operationsand the OR operations can be stored in a group of memory cells thatstore Static_Mask 478 and the compute components (e.g., 331-0 to 331-31in FIG. 3) that store Comp_Comp 431. As such, as shown in FIG. 4A (e.g.,at reference 5), the bit-vector indicating the MSBs corresponding to therespective elements (e.g., a bit-vector [88888888]) is stored in thegroup of memory cells storing bit-vector 478 and is stored in thecompute components storing bit-vector 431.

The pseudocode referenced at reference number 6 (e.g., Store inDynamic_Mask) is associated with storing the bit-vector identifying theMSB corresponding to each of a number of elements represented byDividend 488 and/or Divisor 490 in memory cells that store Dynamic_Mask476. As such, as shown in FIG. 4A (e.g., at reference 6), thehexadecimal bit-vector [88888888] is stored in a group of memory cellsthat store Dynamic_Mask 476.

FIG. 4B illustrates a table showing the states of memory cells of anarray at a number of particular phases associated with performing adivision operation in accordance with a number of embodiments of thepresent disclosure. FIG. 4B includes column 496 which comprisesreference numbers corresponding to the reference numbers of thepseudocode shown above. As such, FIG. 4B indicates the values of thebit-vectors stored in the cells corresponding to bit-vectorsDynamic_Mask 476, Static_Mask 478, Current_Dividend 480, Current_Compare482, Dividend 488, Divisor 490, Quotient 492, and Remainder 494 duringvarious phases associated with performing a division operation. Thetable shown in FIG. 4B also shows the value of the bit-vector Comp_Comp431 during the various phases associated with performing the divisionoperation.

The pseudocode referenced at reference number 7 (e.g., reference number7 a to 7 x and shown as “For given Vector Fixed width”), corresponds toperforming a number of iterations of operations. A number of iterationsof operations can be defined via a loop structure. As used herein, a“loop” is defined as a control flow statement that allows a number ofoperations to be performed in a number of iterations based on a booleancondition. A loop can expressed via a FOR loop, a WHILE loop, and/or aDO loop, among other possible loop structures. Each iteration of theloop that is associated with reference number 7 can include performing anumber of operations. The number of operations can include performingSHIFT operations, OR operations, and/or AND operations, among otheroperations.

The example described in association with FIGS. 4A to 4F includesperforming a FOR loop that includes performing a number of iterations ofa number of operations. In this example, the number of iterations isequal to the element width (e.g., 4). Therefore, in this example, theFOR loop includes performing the number of operations four times. Aparticular iteration of the FOR loop can be annotated by “E”. E can beinitialized to zero and can be incremented by 1 at the beginning of eachiteration of the FOR loop while E is less than the element width (e.g.,4). As such, a different element width can result in performing thenumber of operations more or fewer times than those described in thisexample.

FIG. 4B illustrates the values of a number of bit-vectors (e.g.,bit-vectors 431, 476, 478, 480, 482, 488, 490, 492, and 494) associatedwith performing the number of operations associated with a firstiteration of the FOR loop. As such, FIG. 4B is described with respect toa first iteration (e.g., E=0) corresponding to reference numbers 7 a to7 x. FIG. 4C illustrates the values of the number of bit-vectorsassociated with performing the number of operations associated with asecond iteration of the FOR loop. As such, FIG. 4C is described withrespect to a second iteration (e.g., E=1) corresponding to referencenumbers 7 a to 7 x. FIG. 4D illustrates the values of the number ofbit-vectors associated with performing the number of operationsassociated with a third iteration of the FOR loop. As such, FIG. 4D isdescribed with respect to a third iteration (e.g., E=2) corresponding toreference numbers 7 a to 7 x. FIG. 4E illustrates the values of thenumber of bit-vectors associated with performing the number ofoperations associated with a fourth iteration of the FOR loop. As such,FIG. 4E is described with respect to a fourth iteration (e.g., E=3)corresponding to reference numbers 7 a to 7 x.

The pseudocode referenced at reference number 7 a (e.g., LoadDynamic_Mask in Comp_Comp) is associated with storing the Dynamic_Mask476 (e.g., a bit-vector [88888888]) in the compute components that storeComp_Comp 431. That is, a read operation can be performed to copy thevalue of the bit-vector stored in the cells storing bit-vector 476 tothe compute components (e.g., 331-0 to 331-31 shown in FIG. 3) storingbit-vector 431. The pseudocode referenced at reference number 7 b (e.g.,Store in Current_Dividend) is associated with storing Comp_Comp 431 inthe memory cells that store Current_Dividend 480. That is, thebit-vector stored in the compute components storing bit-vector 431 iscopied to the memory cells storing bit-vector 480. As such, as shown inrow 7 a of FIG. 4B, bit-vector 431 stores [88888888], and as shown inrow 7 b of FIG. 4B, bit-vector 480 also stores [88888888].

The pseudocode referenced at reference number 7 c (e.g., referencenumber 7 ci to 7 ciii and shown as “Loop for current position inelement”) is associated with performing a loop comprising performing anumber of iterations of operations. The number of iterations (e.g., thenumber of times the operations corresponding to reference numbers 7 cito 7 ciii are performed) can be based on a current iteration of the FORloop described above (e.g., described in association with referencenumber 7). For instance, in a first iteration (e.g., for E=0 andassociated with FIG. 4B) of the FOR loop described above, the operationscorresponding to reference numbers 7 ci to 7 ciii are performed zerotimes, in a second iteration (e.g., for E=1 and associated with FIG. 4C)of the FOR loop described above, the operations corresponding toreference numbers 7 ci to 7 ciii are performed once, in a thirditeration (e.g., for E=2 and associated with FIG. 4D) of the FOR loopdescribed above, the operations corresponding to reference numbers 7 cito 7 ciii are performed twice, and in a fourth iteration (e.g., for E=3and associated with FIG. 4E) of the FOR loop described above, theoperations corresponding to reference numbers 7 ci to 7 ciii areperformed three times.

The pseudocode referenced at reference number 7 ci (e.g., Shift Right)is associated with performing a right SHIFT operation. The right SHIFToperation can be performed on Current_Dividend 480. For example,Current_Dividend 480 can be stored (e.g., read into) in the sensingcircuitry (e.g., in the compute components used to store Comp_Comp 431)and the bits of the bit-vector corresponding thereto can each be shiftedto the right by one bit position. Therefore, the SHIFT operation can beperformed on Comp_Comp 431 (e.g., on the bit-vector currently stored inthe compute components storing Comp_Comp 431) such that the result ofthe SHIFT operation can be stored in the sensing circuitry. An INVERToperation can then be performed on Comp_Comp 431, and the result of theINVERT operation can be stored in the sensing circuitry (e.g., as thecurrent value of Comp_Comp 431 and/or in the sense amps corresponding tothe compute components storing Comp_Comp 431). In the example describedin association with FIGS. 4A-4F, the results of various operations(e.g., AND, OR, SHIFT, INVERT) that are stored in the sensing circuitryare initially stored in the compute components corresponding toComp_Comp 431; however, as described further below, the results can bestored initially in sense amplifiers corresponding to the computecomponents, for instance.

The pseudocode referenced at reference number 7 cii (e.g., Perform ORwith Static_Mask) is associated with performing an OR operation onComp_Comp 431 and Static_Mask 478. The result of the OR operation can bestored in the sensing circuitry (e.g., as the current value of Comp_Comp431). An INVERT operation can be performed on Comp_Comp 431. That is,the values of the bits stored in the respective compute componentsstoring Comp_Comp 431 can be inverted. An OR operation can be performedon Comp_Comp 431 and Current_Dividend 480, and the result of the ORoperation can be stored in the sensing circuitry and/or the memory cellsthat store the Current_Dividend 480. The pseudocode referenced atreference number 7 ciii (e.g., Store in Current Dividend) is associatedwith storing the result of the OR operation (e.g., the OR performed onComp_Comp 431 and Current_Dividend 480) in the memory cells that storethe Current_Dividend 480 (e.g., copying the value of Comp_Comp 431 toCurrent_Dividend 480).

Since FIG. 4B corresponds to the first iteration (e.g., E=0) of the FORloop associated with reference number 7, the operations corresponding toreference numbers 7 ci to 7 ciii are performed zero times. As such, asshown in row 7 c of FIG. 4B, the bit-vector Current_Dividend 480 isunchanged as compared to its value shown in row 7 b. That is,Current_Dividend 480 remains [88888888].

The pseudocode referenced at reference number 7 d (e.g., Perform ANDoperation with Dividend) is associated with performing an AND operationon Comp_Comp 431 and Dividend 488, and the result can be stored in(e.g., can remain in) the compute components corresponding to Comp_Comp431. In this example, Comp_Comp 431 is a hexadecimal bit-vector[88888888] which is binary bit-vector [1000 1000 1000 1000 1000 10001000 1000] and Dividend 488 is a hexadecimal bit-vector [774488cc] whichis binary bit-vector [0111 0111 0100 0100 1000 1000 1100 1100]. Theresult of the AND operation is a hexadecimal bit-vector [00008888] whichis binary bit-vector [0000 0000 0000 0000 1000 1000 1000 1000].

As described further below, performing a logical operation (e.g., AND,OR, etc.) on a first and second bit-vector can include performing thelogical operation on respective corresponding bit pairs. For example,performing an AND operation can include “ANDing” the MSBs of therespective bit-vectors with the result being the MSB of the resultantbit-vector, “ANDing” the next MSBs of the respective bit-vectors withthe result being the next MSB of the resultant bit-vector, . . . , and“ANDing” the LSBs of the respective bit-vectors with the result beingthe LSB of the resultant bit-vector. As shown in row 7 d of FIG. 4B, theresult of the AND operation (e.g., [00008888] is stored in Comp_Comp431.

The pseudocode referenced at reference number 7 e (e.g., Store Comp_Compin Current_Dividend) is associated with storing the result of the ANDoperation in the memory cells that store Current_Dividend 488. That is,the value of Comp_Comp 431 (e.g., a bit-vector [00008888]) can be storedin (e.g., copied to) the memory cells that store the Current_Dividend488. As described further below, the bit-vector stored in the computecomponents corresponding to Comp_Comp 431 can be copied to a group ofmemory cells coupled to a selected row and to sense lines coupled to thecorresponding compute components, for instance, by enabling (e.g.,activating) the selected row such that the values stored in the computecomponents are copied (e.g., transferred) to the respectivecorresponding memory cells of the group coupled to the selected row.

The pseudocode referenced at reference number 7 f (e.g., Shift Rightfrom current position to the beginning of Vector) is associated withperforming a right SHIFT operation on Comp_Comp 431. The right SHIFToperation can shift the bits in Comp_Comp 431 a number of positions tothe right (e.g., from a MSB to a LSB). The number of positions shiftedcan be equal to the element width minus E minus 1 (e.g., elementwidth−E−1). In this example in which the element width is four and E iszero (e.g., for the first iteration of the FOR loop associated withreference number 7 and described in association with FIG. 4B), thenumber of positions that the bits are shifted is three (e.g., 4−0−1=3).Shifting each of the bits in bit-vector 431 (e.g., [00008888]) to theright by three bit positions results in bit-vector [00001111]. As such,row 7 f of FIG. 4B illustrates Comp_Comp 431 as [00001111].

The pseudocode referenced at reference number 7 g (e.g., Perform OR withRemainder) is associated with performing an OR operation on Comp_Comp431 and Remainder 494 and storing the result in (e.g., the value remainsin) Comp_Comp 431. Since Comp_Comp 431 is [00001111] and Remainder 494is [00000000], row 7 g of the table shown in FIG. 4B illustratesbit-vector 431 being [00001111] (e.g., the result of “ORing” [00000000]and [00001111]).

The pseudocode referenced at reference numbers 7 h and 7 i (e.g., Storein Current_Dividend and Store in Remainder) is associated with storingComp_Comp 431 in the memory cells that store Current_Dividend 480 andthe memory cells that store Remainder 494. That is, the value ofComp_Comp 431 can be copied to memory cells that store Current_Dividend480 and to Remainder 494. As such, since the value of Comp_Comp 431 is[00001111], row 7 h of FIG. 4B illustrates Current_Dividend 480 being[00001111] and row 7 i of FIG. 4B illustrates Remainder 494 being[00001111].

The pseudocode referenced at reference number 7 j (e.g., Horizontalcompare Current_Dividend with Divisor get greater than mask inCurrent_Compare) is associated with performing a COMPARE operation. TheCOMPARE operation can include determining whether the elements ofCurrent_Divident 480 are greater than or equal to the correspondingelements of Divisor 490. The result of the compare operation can bestored in the memory cells used to store Current_Compare 482 and canidentify those elements in Curren_Dividend 480 that are greater than orequal to the corresponding elements of Divisor 490 and/or those elementsof Current_Dividend 480 that are less than the corresponding elements ofDivisor 490. As an example, a hexadecimal bit vector [0] (e.g., binary[0000]) can indicate that a particular element of Current Dividend 480is less than the corresponding element of Divisor 490, and a hexadecimalbit-vector [F] (e.g., binary [1111]) can indicate that a particularelement of Current_Dividend 480 is greater than or equal to Divisor 490.As shown in row 7 j of FIG. 4B, Current_Dividend 480 is [00001111] andDivisor 490 is [33552233]. Therefore, since each of the elements ofDivisor 490 is greater than the corresponding element ofCurrent_Dividend 480 (e.g., 3>0, 3>0, 5>0, 5>0, 2>1, 2>1, 3>1, and 3>1),the resultant bit-vector of the COMPARE operation is [00000000]. Assuch, row 7 j of FIG. 4B indicates that Current_Compare 482 is[00000000]. In a number of examples, the COMPARE operation can includeperforming a number of operations. The number of operations that areassociated with performing the COMPARE operation can be performed usingthe sensing circuitry (e.g., sense amplifiers 306 and/or the computecomponents 331 in FIG. 3). The number of operations that are associatedwith the COMPARE operation can be performed in parallel and withouttransferring data via an input/output (IVO) line. The number ofoperations can include a number of AND operations, OR operations, SHIFToperations, and INVERT operations.

The pseudocode referenced at reference number 7 k (e.g., Shift rightDynamic_Mask by applying Current_Compare) is associated with performinga right SHIFT operation if E is greater than zero (e.g., E>0). As such,since E=0 in association with FIG. 4B, right SHIFT operation is notperformed and Comp_Comp 431 remains [00000000] (e.g., as shown in row 7k of FIG. 4B).

As described below in association with FIGS. 4C to 4E, the number oftimes the right SHIFT operation is performed is based on E (e.g., ifE=1, the right SHIFT is performed once, if E=2, the right SHIFT isperformed twice, etc). The right SHIFT operation includes storing theDynamic_Mask 476 in the compute components corresponding to Comp_Comp431, and performing a right SHIFT operation on particular elements ofComp_Comp 431 as identified by Current_Compare 482, which is used as amask. That is, as described further below, Current_Compare 482 canindicate which of the elements of Comp_Comp 431 are to be shifted.

The pseudocode referenced at reference number 7 l (e.g., Load inverse ofCurrent_Compare into Comp_Comp) is associated with storingCurrent_Compare 482 in the compute components corresponding to Comp_Comp431 and performing an INVERT operation on Comp_Comp 431 such thatComp_Comp 431 stores the inverse of Current_Compare 482 after the INVERToperation. As such, since Current_Compare 482 has a value of [00000000],row 7 l of FIG. 4B illustrates Comp_Comp 431 as [FFFFFFFF] (e.g., theinverse of [00000000]).

The pseudocode referenced at reference number 7 m (e.g., Perform ANDoperation with Remainder) is associated with performing an ANDoperation. The AND operation can be performed on Comp_Comp 431 andRemainder 494, and the result can be stored in Comp_Comp 431. As shownin row 7 m of FIG. 4B, Comp_Comp 431 is [00001111], which is the resultof ANDing [FFFFFFFF](e.g., the value of Comp_Comp 431 prior to the AND)and [00001111] (e.g., the value of Remainder 494 prior to the AND).

The pseudocode referenced at reference number 7 n (e.g., Store inRow_Current_Dividend) is associated with storing the result of the ANDoperation associated with reference number 7 m in the memory cells thatstore Current_Dividend 480. As such, row 7 n in FIG. 4B illustratesCurrent_Dividend 480 as [00001111]. The pseudocode referenced atreference number 7 o (e.g., Using Current_Compare 482 mask getdifference from Remainder and Divisor into Current_Dividend) isassociated with performing a SUBTRACTION operation and storing theresult as Current_Dividend 480. A SUBTRACTION operation can includesubtracting selected elements in Divisor 490 from corresponding elementsin Remainder 494. The elements from Divisor 490 that are subtracted fromcorresponding elements in Remainder 494 can be selected based onCurrent_Compare 482. That is, Current_Compare 482 can be used as a maskto determine which of the elements are to be subtracted. As such,Current_Compare 482 can identify those elements in Divisor 490 that areto be subtracted from the corresponding elements of Remainder 494. As anexample, a hexadecimal bit vector [0] (e.g., binary [0000]) can indicatethat a particular element of Divisor 490 is not to be subtracted fromthe corresponding element of Remainder 494, and a hexadecimal bit-vector[F] (e.g., binary [1111]) can indicate that a particular element ofDivisor 490 is to be subtracted from the corresponding element ofRemainder 494. As shown in row 7 o of FIG. 4B, Current_Compare 482 is abit-vector [00000000], which indicates that zero (e.g., none) of theeight elements of Divisor 490 (e.g., [33552233]) are to be subtractedfrom the corresponding eight elements of Remainder 494 (e.g.,[00001111]). As such, row 7 o also indicates the value ofCurrent_Dividend is [00001111], which is the same as the value ofRemainder 494 (e.g., since the result of the SUBTRACTION operation isstored in Current_Dividend 480 and the result of the SUBTRACTIONoperation leaves Remainder 494 unchanged). However, if theCurrent_Compare 482 were a bit-vector [0000000F], then the SUBTRACTIONoperation would subtract the eighth element in Divisor 490 from theeighth element in Remainder 494.

In a number of examples, the SUBTRACTION operation can includeperforming a number of operations. The number of operations that areassociated with performing the SUBTRACTION operation can be performedusing the sensing circuitry (e.g., a sense amplifiers 306 and/or thecompute components 331 in FIG. 3). The number of operations that areassociated with the SUBTRACTION operation can be performed withouttransferring data via an input/output (I/O) line. The number ofoperations can include a number of AND operations, OR operations, SHIFToperations, and INVERT operations. The number of operations that areassociated with the SUBTRACTION operation can include performing anumber of SUBTRACTION operations in parallel. Examples of performing theSUBTRACTION operation are given below in association with FIGS. 4C to4F.

The pseudocode referenced at reference number 7 p (e.g., Load Quotientin Comp_Comp) is associated with storing Quotient 492 in the sensingcircuitry. As such, the value of Quotient 492 (e.g., [00000000]) iscopied to Comp_Comp 431 (e.g., as shown in row 7 p of FIG. 4B). Thepseudocode referenced at reference number 7 q (e.g., Shift left, storein Quotient) is associated with performing a left SHIFT operation onComp_Comp 431. The result of the left SHIFT operation can be stored inthe memory cells that store Quotient 492. In this example, shiftingComp_Comp 431 (e.g., [00000000]) left results in bit-vector [00000000]

The pseudocode referenced at reference number 7 r (e.g., UsingCurrent_Compare mask add to Quotient a true bit at the end of each fixedVector) is associated with performing an ADDITION operation. TheADDITION operation can increment a number of selected elements fromQuotient 492. The number of elements from Quotient 492 can be selectedbased on Current_Compare 482 (e.g., Current_Compare 482 can be used as amask that identifies which elements are to be incremented). In the firstiteration (e.g., E=0) of the loop associated with reference number 7,Current_Compare 482 is [00000000] (e.g., as shown in row 7 r of FIG.4B). As such, the mask provided by Current_Compare 482 indicates that noelements from Quotient 492 are selected. Therefore, Quotient 492 isunchanged in this example (e.g., row 7 r illustrates Quotient 492 as[00000000]). As an example, Current_Compare 482 being [ff000000] couldindicate that a first element and a second element from Quotient 492 areselected, which would result in the first element and the second elementof Quotient 492 being incremented by one.

In a number of examples, the ADDITION operation can include performing anumber of operations. The number of operations that are associated withperforming the ADDITION operation can be performed using the sensingcircuitry (e.g., a sense amplifiers 306 and/or the compute components331 in FIG. 3). The number of operations that are associated with theADDITION operation can be performed without transferring data via aninput/output (I/O) line. The number of operations can include a numberof AND operations, OR operations, SHIFT operations, and INVERToperations. The number of operations that are associated with theADDITION operation can include performing a number of ADDITIONoperations in parallel. Further examples of implementing the ADDITIONoperation are given below in association with FIGS. 4C to 4F.

The pseudocode referenced at reference number 7 s (e.g., LoadCurrent_Dividend in Comp_Comp) is associated with storingCurrent_Dividend 480 in the sensing circuitry (e.g., in the computecomponents corresponding to Comp_Comp 431 and/or in sense amplifierscorresponding thereto). As such, row 7 s of FIG. 4B illustrates thevalue of Current_Dividend 480 (e.g., [00001111]) being stored inComp_Comp 431. The pseudocode referenced at reference number 7 t (e.g.,Shift Left) is associated with performing a left SHIFT operation onComp_Comp 431. In this example, the value of Comp_Comp 431 is [00001111]prior to the left SHIFT. As such, row 7 t of FIG. 4B illustrates thevalue of Comp_Comp as [00002222] after the left SHIFT. The pseudocodereferenced at reference number 7 u (e.g., Store Comp_Comp inCurrent_Dividend and Remainder) is associated with storing the result ofthe left SHIFT operation in the memory cells that store Current_Dividend480, the memory cells that store Remainder 494, and in the sensingcircuitry. In this example, Comp_Comp is [00002222] after the leftSHIFT, and this value is copied to Current_Dividend 480 and Remainder494 (e.g., as shown in row 7 u of FIG. 4B).

The pseudocode referenced at reference number 7 v (e.g., LoadDynamic_Mask in Comp_Comp) is associated with storing Dynamic_Mask 476in the sensing circuitry. For instance, the value of Dynamic_Mask 476can be copied to Comp_Comp 431. As such, row 7 v of FIG. 4B illustratesthe value of Dynamic_Mask 476 (e.g., [88888888] being stored inComp_Comp 431.

The pseudocode referenced at reference number 7 w (e.g., Shift Comp_Compright applying mask in Current_Compare) is associated with performing aright SHIFT operation on Comp_Comp 431, storing the result of the rightSHIFT operation in Comp_Comp 431, performing an AND operation onComp_Comp 431 and Current_Compare 482, storing the result of the ANDoperation in Comp_Comp 431 and in the memory cells that storeCurrent_Dividend 480. In the operations performed in reference number 7w, Current_Compare 431 is used as a mask to identify the elements thatwill be right shifted. Current_Compare 482 is then stored in (e.g.,copied to) Comp_Comp 431, an INVERT operation is performed on Comp_Comp431 (e.g., such that Comp_Comp 431 stores the inverted value ofCurrent_Compare 482), an AND operation is performed on the result of theINVERT operation and Dynamic_Mask 476 (e.g., Comp_Comp 431 is ANDed withDynamic_Mask 476), an OR operation is performed on the result of the ANDoperation and Current_Dividend 480 (e.g., Comp_Comp 431 is ORed withCurrent_Dividend 480), and the result of the OR operation is stored inComp_Comp 431.

For example, the right SHIFT operation is performed on Comp_Comp 431(e.g., a bit-vector [88888888]), the result [44444444] is stored inComp_Comp 431. The AND operation is performed on [44444444] (e.g.,Comp_Comp 431 and [00000000] (e.g., Current_Compare 482) and the result[00000000] is stored in the sensing circuitry and the memory cells thatstore Current_Dividend 480. In this example, the Current_Compare 482 is[00000000] and as such no elements are right shifted. A bit-vector[00000000] is stored in the sensing circuitry, an INVERT operation isperformed on [00000000] (e.g., Comp_Comp 431), an AND operation isperformed on the result [ffffffff] of the INVERT operation and on[88888888] (e.g., Dynamic_Mask 476). An OR operation is performed on[88888888] (e.g., the result of the AND operation) and [00000000] (e.g.,Current_Dividend 480) and the result [88888888] is stored in the sensingcircuitry.

The pseudocode referenced at reference number 7 x (e.g., Store Comp_Compin Dynamic_Mask) is associated with storing the result of the ORoperation in the memory cells that store Dynamic_Mask 476. That is,Comp_Comp 431 is stored in the memory cells that store Dynamic_Mask 476.Therefore, as shown in row 7 x of FIG. 4B, Dynamic_Mask 476 is[88888888].

FIG. 4C illustrates a table showing the values of the number ofbit-vectors (e.g., 431, 476, 478, 480, 482, 488, 490, 492, and 494)associated with performing a number of operations associated with asecond iteration of the FOR loop associated with reference number 7. Assuch, FIG. 4C is described with respect to a second iteration (e.g.,E=1) corresponding to reference numbers 7 a-7 x.

Row 7 a of FIG. 4C illustrates the result of storing the Dynamic_Mask476 (e.g., a bit-vector [88888888]) in the compute components (e.g.,compute components 331 in FIG. 3) corresponding to Comp_Comp 431. Assuch, Comp_Comp is [88888888] in row 7 a. Row 7 b of FIG. 4C illustratesthe value of Current_Dividend 480 (e.g., [88888888]) after the value ofComp_Comp 431 is copied thereto.

Reference number 7 c is associated with performing a loop based on Ebeing equal to 1. The pseudocode referenced at reference number 7 c caninclude storing the bit-vector [CCCCCCCC] in the memory cells that storeCurrent_Dividend 480.

Row 7 d of FIG. 4C illustrates the result of performing an AND operationon Comp_Comp 431 (e.g., a bit-vector [CCCCCCCC]) and Dividend 488 (e.g.,a bit-vector [774488CC]). As such, Comp_Comp 431 is [444488CC] in row 7d. Row 7 e of FIG. 4C illustrates storing the result (e.g., a bit-vector[444488CC]) of the AND operation in the memory cells that storeCurrent_Dividend 488.

Row 7 f of FIG. 4C illustrates the result of performing a right SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [444488cc]). As such,Comp_Comp is [11112233] in row 7 f.

Row 7 g of FIG. 4C illustrates the result of performing an OR operationon Comp_Comp 431 (e.g., a bit-vector [11112233]) and Remainder 494(e.g., a bit-vector [00002222]). As such, Comp_Comp is [11112233] in row7 g. Rows 7 h to 7 i of FIG. 4C illustrate storing Comp_Comp 431 (e.g.,a bit-vector [11112233]) in the memory cells that store Current_Dividend480 and the memory cells that store Remainder 494.

Row 7 j of FIG. 4C illustrates the result of performing a COMPAREoperation on Current_Dividend 480 (e.g., a bit-vector [11112233]) andDivisor 490 (e.g., a bit-vector [33552233]). As such, Current_Compare482 is [0000FFFF] in row 7 j.

Row 7 k of FIG. 4C illustrates the result of performing a right SHIFToperation based on E being greater than zero during a second iterationof the loop structure associated with reference number 7. That is,Dynamic_Mask 476 (e.g., a bit-vector [88888888]) is stored in thesensing circuitry, a right SHIFT operation is performed on Comp_Comp 431(e.g., a bit-vector [88888888]) based on Current_Compare 482, andComp_Comp 431 is stored in the memory cells that store Dynamic_Mask 476.Performing a right SHIFT operation on Comp_Comp 431 (e.g., a bit-vector[88888888]) based on Current_Compare 482 includes using Current_Compare482 (e.g., a bit-vector [0000FFFF]) as a mask to identify elements fromComp_Comp 431. In this example, the mask provided by Current_Compare 482indicates (e.g., via hexadecimal [F]) that the fifth, sixth, seventh,and eighth elements in Comp_Comp 431 are to be shifted Right. Since thenumber of times the right SHIFT operation is performed is based on E, inthis case, the right SHIFT is performed once (e.g., E=1). As such, theidentified elements of Comp_Comp 431 are shifted right one bit position,and the result (e.g., a bit-vector [88884444]) is stored in memory cellsthat store Dynamic_Mask 476 (e.g., as shown in row 7 k of FIG. 4C.

Row 7 l of FIG. 4C illustrates the result of storing Current_Compare 482(e.g., a bit-vector [0000FFFF]) in the sensing circuitry and performingan INVERT operation on Comp_Comp 431 (e.g., a bit-vector [0000FFFF]). Assuch, Comp_Comp 431 is [FFFF0000] in row 7 l.

Row 7 m of FIG. 4C illustrates the result of performing an AND operationon Comp_Comp 431 (e.g., a bit-vector [FFFF0000]) and Remainder 494(e.g., a bit-vector [11112233]). As such, Comp_Comp 431 is [11110000] inrow 7 m.

Row 7 n of FIG. 4C illustrates the result of storing the result (e.g., abit-vector [11110000]) of the AND operation associated with referencenumber 7 m in the memory cells that store Current_Dividend 480. As such,Current_Dividend 480 is [11110000] in row 7 n.

Row 7 o of FIG. 4C illustrates the result of performing a SUBTRACTIONoperation. In the example given in FIG. 4C, Current_Compare 482 is abit-vector [0000FFFF] which indicates that the fifth, sixth, seventh,and eighth elements (e.g., a bit-vector [2233]) from Divisor 490 aresubtracted from the associated elements (e.g., a bit-vector [2233]) inRemainder 494. The result (e.g., a bit-vector [11110000]) of theSUBTRACTION operation is stored in the memory cells that storeCurrent_Dividend 480. As such, Current_Dividend 480 is [11110000] in row7 o.

Row 7 p of FIG. 4C illustrates the result of storing Quotient 492 (e.g.,a bit-vector [00000000]) in the sensing circuitry. As such, Comp_Comp431 is [00000000] in row 7 p.

Row 7 q of FIG. 4C illustrates the result of performing a left SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [00000000]). As such,Quotient 492 is [00000000] in row 7 q.

Row 7 r of FIG. 4C illustrates the result of performing an ADDITIONoperation. The ADDITION operation increments a number of elements fromQuotient 492. The number of elements from Quotient 492 can be selectedbased on Current_Compare 482. Current_Compare 482 is equal to abit-vector [0000FFFF] in the second iteration of a loop structureassociated with reference number 7. The fifth, sixth, seventh, andeighth elements from Quotient 492 are selected based on Current_Compare482. The ADDITION operation increments the fifth, sixth, seventh, andeighth, elements from Quotient 492 by one. As such, Quotient 492 is[00001111] in row 7 r.

Row 7 s of FIG. 4C illustrates the result of storing Current_Dividend480 (e.g., a bit-vector [11110000]) in the sensing circuitry. As such,Comp_Comp 431 is [11110000] in row 7 s.

Row 7 t of FIG. 4C illustrates the result of performing a left SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [11110000]). As such,Comp_Comp 431 is [22220000] in row 7 t.

Row 7 u of FIG. 4C illustrates the result of storing the result (e.g., abit-vector [22220000]) of the left SHIFT operation in the memory cellsthat store Current_Dividend 480, the memory cells that store Remainder494, and the sensing circuitry. As such, Current_Dividend 480, Remainder494, and Comp_Comp 431 are [22220000] in row 7 u.

Row 7 v of FIG. 4C illustrates the result of storing Dynamic_Mask 476(e.g., a bit-vector [88884444]) in the sensing circuitry. As such,Comp_Comp 431 is [88884444] in row 7 v.

Row 7 w of FIG. 4C illustrates the result of performing a right SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [88884444]). The result(e.g., a bit-vector [44442222]) of the right SHIFT operation is storedin Comp_Comp 431. An AND operation is performed on Comp_Comp 431 (e.g.,a bit-vector [44442222]) and Current_Compare 482 (e.g., a bit-vector[0000ffff]). The result (e.g., a bit-vector [00002222]) of the ANDoperation is stored in the sensing circuitry and the memory cells thatstore Current_Dividend 480. Current_Compare 482 (e.g., a bit-vector[0000ffff]) is stored in the sensing circuitry. An INVERT operation isperformed on Comp_Comp 431 (e.g., a bit-vector [0000ffff]). An ANDoperation is performed on the result (e.g., a bit-vector [ffff0000]) ofthe INVERT operation and Dynamic_Mask 476 (e.g., a bit-vector[88884444]). An OR operation is performed on the result (e.g., abit-vector [88880000]) of the AND operation and Current_Dividend 480(e.g., a bit-vector [00002222]). The result (e.g., a bit-vector[88882222]) of the OR operation is stored in the sensing circuitry. Assuch, Comp_Comp 431 is [88882222] in row 7 w.

Row 7 x of FIG. 4C illustrates the result of storing the result of theOR operation in the memory cells that store Dynamic_Mask 476. As such,Dynamic_Mask 476 is [88882222] in row 7 x.

FIG. 4D illustrates a table showing the values of the number ofbit-vectors (e.g., 431, 476, 478, 480, 482, 488, 490, 492, and 494)associated with performing a number of operations associated with asecond iteration of the FOR loop associated with reference number 7. Assuch, FIG. 4D is described with respect to a second iteration (e.g.,E=2) corresponding to reference numbers 7 a-7 x.

Row 7 a of FIG. 4D illustrates the result of storing Dynamic_Mask 476(e.g., a bit-vector [88882222]) in the compute components 331 in FIG. 3.As such, Comp_Comp 431 is [88882222] in row 7 a.

Row 7 b of FIG. 4D illustrates the result of storing Comp_Comp 431 inthe memory cells that store Current_Dividend 480. As such,Current_Dividend 480 is [88882222] in row 7 b.

Row 7 c of FIG. 4D illustrates the result of performing a loop thatperforms E iterations. That is, the loop associated with referencenumber 7 c will perform two iterations of the loop based on E beingequal to 2. Each iteration of the loop reference in reference number 7 cperforms a number of operations. The pseudocode referenced at referencenumber 7.c can include storing the bit-vector [EEEE3333] in the memorycells that store Current_Dividend 480. As such, Current_Dividend 480 is[EEEE3333] in row 7 c.

Row 7 d of FIG. 4D illustrates the result of performing an AND operationon Comp_Comp 431 (e.g., a bit-vector [eeee3333]) and Dividend 488 (e.g.,a bit-vector [774488cc]). As such, Comp_Comp 431 is [66440000] in row 7d.

Row 7 e of FIG. 4D illustrates the result of storing Comp_Comp 431(e.g., a bit-vector [66440000]) in the memory cells that store theCurrent_Dividend 488. As such, Current_Dividend 488 is [66440000] in row7 e.

Row 7 f of FIG. 4D illustrates the result of performing a right SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [66440000]). The rightSHIFT operation can shift the bits in Comp_Comp 431 a number ofpositions. The number of positions can be equal to the element widthminus E minus 1 (e.g., element width−E−1). For example, the number ofpositions can be equal to one during a third iteration of the loopstructure associated with reference number 7. The result (e.g., abit-vector [33220000]) of the right SHIFT operation is stored in thesensing circuitry. As such, Comp_Comp 431 is [33220000] in row 7 f.

Row 7 g of FIG. 4D illustrates the result of performing an OR operationon Comp_Comp 431 (e.g., a bit-vector [33220000]) and Remainder 494(e.g., a bit-vector [22220000]). As such, Comp_Comp 431 is [33220000] inrow 7 g.

Rows 7 h to 7 i of FIG. 4D illustrate the result of storing Comp_Comp431 (e.g., a bit-vector [33220000]) in the memory cells that storeCurrent_Dividend 480 and the memory cells that store Remainder 494. Assuch, Remainder 494 is [33220000] in row 7 g.

Row 7 j of FIG. 4D illustrates the result of performing a COMPAREoperation. The COMPARE operation compares Current_Dividend 480 (e.g., abit-vector [33220000]) with Divisor 490 (e.g., a bit-vector [33552233]).As such, Current_Compare 482 is [FF000000] in row 7 j.

Row 7 k of FIG. 4B illustrates the result of performing a right SHIFToperation based on E being greater than zero during a third iteration ofthe loop structure associated with reference number 7. That is,Dynamic_Mask 476 (e.g., a bit-vector [88882222]) is stored in thesensing circuitry, a right SHIFT operation is performed on Comp_Comp 431(e.g., a bit-vector [88882222]) based on Current_Compare 482, andComp_Comp 431 is stored in the memory cells that store Dynamic_Mask 476.Performing a right SHIFT operation on Comp_Comp 431 (e.g., a bit-vector[88882222]) based on Current_Compare 482 includes using Current_Compare482 (e.g., a bit-vector [ff000000]) as a mask to identify elements fromComp_Comp 431. Current_Compare 482 can be used to identify the firstelement and the second element in Comp_Comp 431. The right SHIFToperation can be performed on the identified elements from Comp_Comp431. The right SHIFT operation can be performed on identified elements anumber of times. The iterations of the right SHIFT operation can bebased on E. That is, a right SHIFT operation can be performed on theidentified elements due to E being equal to two. As such, Dynamic_Mask4769 is [22882222] in row 7 k.

Row 7 l of FIG. 4D illustrates the result of storing Current_Compare 482(e.g., a bit-vector [FF000000]) in the sensing circuitry and performingan INVERT operation on Comp_Comp 431 (e.g., a bit-vector [FF000000]). Assuch, Comp_Comp 431 is [00FFFFFF] in row 7 l.

Row 7 m of FIG. 4D illustrates the result of performing an ANDoperation. The AND operation can be performed on Comp_Comp 431 (e.g., abit-vector [00FFFFFF]) and Remainder 494 (e.g., a bit-vector[33220000]). As such, Comp_Comp 431 is [00220000] in row 7 m.

Row 7 n of FIG. 4D illustrates the result of storing the result (e.g., abit-vector [00220000]) of the AND operation in the memory cells thatstore Current_Dividend 480. As such, Current_Dividend 480 is [00220000]in row 7 n.

Row 7 o of FIG. 4D illustrates the result of performing a SUBTRACTIONoperation. Current_Compare 482 is a bit-vector [ff000000] whichindicates that the first and second elements (e.g., a bit-vector [33])from Divisor 490 are subtracted from the associated elements (e.g., abit-vector [33]) in Remainder 494. As such, Current_Dividend 480 is[00220000] in row 7 o.

Row 7 p of FIG. 4D illustrates the result of storing Quotient 492 (e.g.,a bit-vector [00001111]) in the sensing circuitry. As such, Comp_Comp431 is [00001111] in row 7 p.

Row 7 q of FIG. 4D illustrates the result of performing a left SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [00001111]). As such,Quotient 492 is [00002222] in row 7 q.

Row 7 r of FIG. 4D illustrates the result of performing an ADDITIONoperation. The ADDITION operation can increment a number of elementsfrom Quotient 492. The number of elements from Quotient 492 can beselected based on Current_Compare 482. In the third iteration of a loopstructure associated with reference number 7 Current_Compare 482 isequal to a bit-vector [FF000000]. The first and second elements fromQuotient 492 are selected based on Current_Compare 482. The ADDITIONoperation increments the first and second elements from Quotient 492 byone. As such, Quotient 492 is [11002222] in row 7 r.

Row 7 s of FIG. 4D illustrates the result of storing Current_Dividend480 (e.g., a bit-vector [00220000]) in sensing circuitry. As such,Comp_Comp 431 is [00220000] in row 7 s.

Row 7 t of FIG. 4D illustrates the result of performing a left SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [00220000]). As such,Comp_Comp 431 is [00440000] in row 7 t. Row 7 u of FIG. 4D illustratesthe result of storing the result (e.g., a bit-vector [00440000]) of theleft SHIFT operation in the memory cells that store Current_Dividend480, the memory cells that store Remainder 494, and the sensingcircuitry. As such, Comp_Comp 431, Current_Dividend 480, and Remainder494 are [00440000] in row 7 u.

Row 7 v of FIG. 4D illustrates the result of storing Dynamic_Mask 476(e.g., a bit-vector [22882222]) in the sensing circuitry. As such,Comp_Comp 431 is [22882222] in row 7 v.

Row 7 w of FIG. 4D illustrates the result of performing a right SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [22884444]). The result(e.g., a bit-vector [11441111]) of the right SHIFT operation is storedin Comp_Comp 431. An AND operation is performed on Comp_Comp 431 (e.g.,a bit-vector [11441111]) and Current_Compare 482 (e.g., a bit-vector[ff000000]). The result (e.g., a bit-vector [11000000]) of the ANDoperation is stored in the sensing circuitry and the memory cells thatstore Current_Dividend 480. Current_Compare 482 (e.g., a bit-vector[ff000000]) is stored in the sensing circuitry. An INVERT operation isperformed on Comp_Comp 431 (e.g., a bit-vector [00ffffff]). An ANDoperation is performed on the result (e.g., a bit-vector [00ffffff]) ofthe INVERT operation and Dynamic_Mask 476 (e.g., a bit-vector[22882222]). An OR operation is performed on the result (e.g., abit-vector [00882222]) of the AND operation and Current_Dividend 480(e.g., a bit-vector [11000000]). The result (e.g., a bit-vector[11882222]) of the OR operation is stored in the sensing circuitry. Assuch, Comp_Comp 431 is [11882222] in row 7 w.

Row 7 x of FIG. 4D illustrates the result of storing the result of theOR operation in the memory cells that store Dynamic_Mask 476. As such,Dynamic_Mask 476 is [11882222] in row 7 x.

FIG. 4E illustrates a table showing the values of the number ofbit-vectors (e.g., 431, 476, 478, 480, 482, 488, 490, 492, and 494)associated with performing a number of operations associated with athird iteration of the FOR loop associated with reference number 7. Assuch, FIG. 4E is described with respect to a second iteration (e.g.,E=3) corresponding to reference numbers 7 a-7 x.

Row 7 a of FIG. 4E illustrates the result of storing the Dynamic_Mask476 (e.g., a bit-vector [11882222]) in the compute component 331 in FIG.3. As such, Dynamic_Mask 476 is [11882222] in row 7 a.

Row 7 b of FIG. 4E illustrates the result of storing Comp_Comp 431 inthe memory cells that store Current_Dividend 480. As such,Current_Dividend 480 is [11882222] in row 7 b.

Row 7 c of FIG. 4E illustrates the result of performing a loop thatperforms E iterations. That is, the loop associated with referencenumber 7 c will perform three iterations of the loop based on E beingequal to 3. Each iteration of the loop reference in reference number 7 cperforms a number of operations. The pseudocode referenced at referencenumber 7 c can include storing the bit-vector [11FF3333] in the memorycells that store Current_Dividend 480. As such, Current_Dividend 480 is[11FF3333] in row 7 c.

Row 7 d of FIG. 4E illustrates the result of performing an AND operationon Comp_Comp 431 (e.g., a bit-vector [11FF3333]) and Dividend 488 (e.g.,a bit-vector [774488cc]). As such, Comp_Comp 431 is [11440000] in row 7d. Row 7 e of FIG. 4E illustrates the result of storing the result ofthe AND operation in the memory cells that store Current_Dividend 488.As such, Current_Dividend 488 is [11440000] in row 7 e.

Row 7 f of FIG. 4E illustrates the result of performing a right SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [11440000]). The rightSHIFT operation can shift the bits in Comp_Comp 431 a number ofpositions. The number of positions can be equal to the element widthminus E minus 1 (e.g., element width−E−1). The number of positions canbe equal to zero during the fourth iteration of the loop structureassociated with reference number 7. The result (e.g., a bit-vector[11440000]) of the right SHIFT operation is stored in the sensingcircuitry. As such, Comp_Comp 431 is [11440000] in row 7 f.

Row 7 g of FIG. 4E illustrates the result of performing an OR operationon Comp_Comp 431 (e.g., a bit-vector [11440000]) and Remainder 494(e.g., a bit-vector [00440000]). As such, Comp_Comp 431 is [11440000] inrow 7 g.

Rows 7 h to 7 i of FIG. 4E illustrate the result of storing Comp_Comp431 (e.g., a bit-vector [11440000]) in the memory cells that storeCurrent_Dividend 480 and the memory cells that store Remainder 494. Assuch, Current_Dividend 480 and Remainder 494 are [11440000] in rows 7 hto 7 i.

Row 7 j of FIG. 4E illustrates the result of performing a COMPAREoperation. The COMPARE operation compares Current_Dividend 480 (e.g., abit-vector [11440000]) with Divisor 490 (e.g., a bit-vector [33552233]).The results (e.g., a bit-vector [00000000]) of the COMPARE operation canbe stored in the memory cells that store Current_Compare 482. As such,Current_Compare 482 is [00000000] in row 7 j.

Row 7 k of FIG. 4E illustrates the result of performing a right SHIFToperation based on E being greater than zero during a fourth iterationof the loop structure associated with reference number 7. That is,Dynamic_Mask 476 (e.g., a bit-vector [11882222]) is stored in thesensing circuitry, a right SHIFT operation is performed on Comp_Comp 431(e.g., a bit-vector [11882222]) based on Current_Compare 482, andComp_Comp 431 is stored in the memory cells that store Dynamic_Mask 476.Performing a right SHIFT operation on Comp_Comp 431 (e.g., a bit-vector[11882222]) based on Current_Compare 482 includes using Current_Compare482 (e.g., a bit-vector [00000000]) as a mask to identify elements fromComp_Comp 431. No elements are identified due to Current_Compare 482having a value equal to a bit-vector [00000000]. The result (e.g., abit-vector [11882222]) of the iterations of the right SHIFT operationcan be stored in memory cells that store Dynamic_Mask 476. As such,Dynamic_Mask 476 is [11882222] in row 7 k.

Row 7 l of FIG. 4E illustrates the result of storing Current_Compare 482(e.g., a bit-vector [00000000]) in the sensing circuitry and performingan INVERT operation on Comp_Comp 431 (e.g., a bit-vector [00000000]). Assuch, Comp_Comp 431 is [FFFFFFFF] in row 7 l.

Row 7 m of FIG. 4E illustrates the result of performing an ANDoperation. The AND operation is performed on Comp_Comp 431 (e.g., abit-vector [FFFFFFFF]) and Remainder 494 (e.g., a bit-vector[11440000]). As such, Comp_Comp 431 is [11440000] in row 7 m. Row 7 n ofFIG. 4E illustrates the result of storing the result (e.g., a bit-vector[11440000]) of the AND operation in the memory cells that storeCurrent_Dividend 480. As such, Current_Dividend 480 is [11440000] in row7 n.

Row 7 o of FIG. 4E illustrates the result of performing a SUBTRACTIONoperation. Current_Compare 482 is a bit-vector [00000000] whichindicates that no elements are subtracted from Remainder 494. As such,Current_Dividend 480 is [11440000] in row 7 o.

Row 7 p of FIG. 4E illustrates the result of storing Quotient 492 (e.g.,a bit-vector [11002222]) in the sensing circuitry. As such, Comp_Comp431 is [11002222] in row 7 p.

Row 7 q of FIG. 4E illustrates the result of performing a left SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [11002222]). As such,Quotient 492 is [22004444] in row 7 q.

Row 7 r of FIG. 4E illustrates the result of performing an ADDITIONoperation. The ADDITION operation can increment a number of elementsfrom Quotient 492. The number of elements from Quotient 492 can beselected based on Current_Compare 482. Current_Compare 482 is equal to abit-vector [00000000] in the fourth iteration of a loop structureassociated with reference number 7. No elements are selected based onCurrent_Compare 482. As such, Quotient 492 is [22004444] in row 7 r.

Row 7 s of FIG. 4E illustrates the result of storing Current_Dividend480 (e.g., a bit-vector [11440000]) in sensing circuitry. As such,Comp_Comp 431 is [11440000] in row 7 s.

Row 7 t of FIG. 4E illustrates the result of performing a left SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [11440000]). As such,Comp_Comp 431 is [22880000] in row 7 t.

Row 7 u of FIG. 4E illustrates the result of storing the result (e.g., abit-vector [22880000]) of the left SHIFT operation in the memory cellsthat store Current_Dividend 480, the memory cells that store Remainder494, and the sensing circuitry. As such, Current_Dividend 480, Remainder494, and Comp_Comp is [22880000] in row 7 u.

Row 7 v of FIG. 4E illustrates the result of storing Dynamic_Mask 476(e.g., a bit-vector [11882222]) in the sensing circuitry. As such,Comp_Comp 431 is [11882222] in row 7 v.

Row 7 w of FIG. 4E illustrates the result of performing a right SHIFToperation on Comp_Comp 431 (e.g., a bit-vector [11884444]). The result(e.g., a bit-vector [00442222]) of the right SHIFT operation is storedin Comp_Comp 431. An AND operation is performed on Comp_Comp 431 (e.g.,a bit-vector [00442222]) and Current_Compare 482 (e.g., a bit-vector[00000000]). The result (e.g., a bit-vector [00000000]) of the ANDoperation is stored in the sensing circuitry and the memory cells thatstore Current_Dividend 480. Current_Compare 482 (e.g., a bit-vector[00000000]) is stored in the sensing circuitry. An INVERT operation isperformed on Comp_Comp 431 (e.g., a bit-vector [FFFFFFFF]). An ANDoperation is performed on the result (e.g., a bit-vector [FFFFFFFF]) ofthe INVERT operation and Dynamic_Mask 476 (e.g., a bit-vector[11882222]). An OR operation is performed on the result (e.g., abit-vector [11882222]) of the AND operation and Current_Dividend 480(e.g., a bit-vector [00000000]). As such, Comp_Comp 431 is [11882222] inrow 7 w.

Row 7 x of FIG. 4E illustrates the result of storing the result of theOR operation in the memory cells that store Dynamic_Mask 476. As such,Dynamic_Mask 476 is [11882222] in row 7 x.

FIG. 4F illustrates a table showing the values of the number ofbit-vectors (e.g., 431, 476, 478, 480, 482, 488, 490, 492, and 494)associated with performing a number of operations associated withreference number 8. Row 8 of FIG. 4F illustrates the result ofperforming a right SHIFT operation on Remainder 494 (e.g., a bit-vector[22880000]). As such, Remainder 494 is [11440000] in row 8.

Quotient 492 (e.g. a bit-vector [22004444]) and reminder 494 (e.g., abit-vector [11440000]) are a result of a division operation that dividesDividend 488 (e.g., a bit-vector [774488cc]) by Divisor 490 (e.g., abit-vector [33552233]). For example, the first element (e.g., abit-vector [77]) from Dividend 488 (e.g., a bit-vector [774488cc])divided by a first element (e.g., a bit-vector [33]) from Divisor 490(e.g., a bit-vector [33552233]) is equal to a first element (e.g., abit-vector [22]) from Quotient 492 (e.g., a bit-vector [22004444])Remainder a first element (e.g., a bit-vector [11]) from Remainder 494(e.g., a bit-vector [11440000]). Embodiments however, are not limited tothe order of the sequence of instructions in the pseudocode in thisexample.

The functionality of the sensing circuitry 250 of FIG. 2A is describedbelow and summarized in Table 1 below with respect to performing logicaloperations and initially storing a result in the sense amplifier 206.Initially storing the result of a particular logical operation in theprimary latch of sense amplifier 206 can provide improved versatility ascompared to previous approaches in which the result may initially residein a secondary latch (e.g., accumulator) of a compute component 231, andthen be subsequently transferred to the sense amplifier 206, forinstance.

TABLE 1 Operation Accumulator Sense Amp AND Unchanged Result ORUnchanged Result NOT Unchanged Result SHIFT Unchanged Shifted Data

Initially storing the result of a particular operation in the senseamplifier 206 (e.g., without having to perform an additional operationto move the result from the compute component 231 (e.g., accumulator) tothe sense amplifier 206) is advantageous because, for instance, theresult can be written to a row (of the array of memory cells) or backinto the accumulator without performing a precharge cycle (e.g., on thecomplementary data lines 205-1 (D) and/or 205-2 (D_)).

FIG. 5 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure. FIG. 5 illustrates atiming diagram associated with initiating an AND logical operation on afirst operand and a second operand. In this example, the first operandis stored in a memory cell coupled to a first access line (e.g., ROW X)and the second operand is stored in a memory cell coupled to a secondaccess line (e.g., ROW Y). Although the example refers to performing anAND on data stored in cells corresponding to one particular column,embodiments are not so limited. For instance, an entire row of datavalues can be ANDed, in parallel, with a different row of data values.For example, if an array comprises 2,048 columns, then 2,048 ANDoperations could be performed in parallel.

FIG. 5 illustrates a number of control signals associated with operatingsensing circuitry (e.g., 250) to perform the AND logical operation. “EQ”corresponds to an equilibrate signal applied to the sense amp 206, “ROWX” corresponds to an activation signal applied to access line 204-X,“ROW Y” corresponds to an activation signal applied to access line204-Y, “Act” and “RnIF” correspond to a respective active positive andnegative control signal applied to the sense amp 206, “LOAD” correspondsto a load control signal (e.g., LOAD/PASSD and LOAD/PASSDb shown in FIG.2A), and “AND” corresponds to the AND control signal shown in FIG. 2A.FIG. 5 also illustrates the waveform diagrams showing the signals (e.g.,voltage signals) on the digit lines D and D_ corresponding to sense amp206 and on the nodes S1 and S2 corresponding to the compute component231 (e.g., Accum) during an AND logical operation for the various datavalue combinations of the Row X and Row Y data values (e.g., diagramscorrespond to respective data value combinations 00, 10, 01, 11). Theparticular timing diagram waveforms are discussed below with respect tothe pseudo code associated with an AND operation of the circuit shown inFIG. 2A.

An example of pseudo code associated with loading (e.g., copying) afirst data value stored in a cell coupled to row 204-X into theaccumulator can be summarized as follows:

Copy Row X into the Accumulator:

-   -   Deactivate EQ;    -   Open Row X;    -   Fire Sense Amps (after which Row X data resides in the sense        amps)    -   Activate LOAD (sense amplifier data (Row X) is transferred to        nodes S1 and S2 of the Accumulator and resides there        dynamically)    -   Deactivate LOAD;    -   Close Row X;    -   Precharge;

In the pseudo code above, “Deactivate EQ” indicates that anequilibration signal (EQ signal shown in FIG. 5) corresponding to thesense amplifier 206 is disabled at t₁ as shown in FIG. 5 (e.g., suchthat the complementary data lines (e.g., 205-1 (D) and 205-2 (D_) are nolonger shorted to V_(DD)/2). After equilibration is disabled, a selectedrow (e.g., ROW X) is enabled (e.g., selected, opened such as byactivating a signal to select a particular row) as indicated by “OpenRow X” in the pseudo code and shown at t₂ for signal Row X in FIG. 5.When the voltage signal applied to ROW X reaches the threshold voltage(Vt) of the access transistor (e.g., 202-2) corresponding to theselected cell, the access transistor turns on and couples the data line(e.g., 205-2 (D_)) to the selected cell (e.g., to capacitor 203-2) whichcreates a differential voltage signal between the data lines.

After Row X is enabled (e.g., activated), in the pseudo code above,“Fire Sense Amps” indicates that the sense amplifier 206 is enabled toset the primary latch and subsequently disabled. For example, as shownat t₃ in FIG. 5, the ACT positive control signal (e.g., 265 shown inFIG. 2B) goes high and the RnIF negative control signal (e.g., 228 shownin FIG. 2B) goes low, which amplifies the differential signal between205-1 (D) and D_ 205-2, resulting in a voltage (e.g., V_(DD))corresponding to a logic 1 or a voltage (e.g., GND) corresponding to alogic 0 being on data line 205-1 (D) (and the voltage corresponding tothe other logic state being on complementary data line 205-2 (D_)). Thesensed data value is stored in the primary latch of sense amplifier 206.The primary energy consumption occurs in charging the data lines (e.g.,205-1 (D) or 205-2 (D_)) from the equilibration voltage V_(DD)/2 to therail voltage V_(DD).

The four sets of possible sense amplifier and accumulator signalsillustrated in FIG. 5 (e.g., one for each combination of Row X and Row Ydata values) shows the behavior of signals on data lines D and D_. TheRow X data value is stored in the primary latch of the sense amp. Itshould be noted that FIG. 2A shows that the memory cell includingstorage element 203-2 and access transistor 202-2, corresponding to RowX, is coupled to the complementary data line D_, while the memory cellincluding storage element 203-1 and access transistor 202-1,corresponding to Row Y, is coupled to data line D. However, as can beseen in FIG. 2A, the charge stored in the memory cell comprising accesstransistor 202-2 (corresponding to Row X) corresponding to a “0” datavalue causes the voltage on data line D_ (to which access transistor202-2 is coupled) to go high and the charge stored in the memory cellcomprising access transistor 202-2 corresponding to a “1” data valuecauses the voltage on data line D_ to go low, which is oppositecorrespondence between data states and charge stored in the memory cellcomprising access transistor 202-1, corresponding to Row Y, that iscoupled to data line D. These differences in storing charge in memorycells coupled to different data lines is appropriately accounted forwhen writing data values to the respective memory cells.

After firing the sense amps, in the pseudo code above, “Activate LOAD”indicates that the LOAD control signal goes high as shown at t₄ in FIG.5, causing load/pass transistors 218-1 and 218-2 to conduct. In thismanner, activating the LOAD control signal enables the secondary latchin the accumulator of the compute component 231. The sensed data valuestored in the sense amplifier 206 is transferred (e.g., copied) to thesecondary latch. As shown for each of the four sets of possible senseamplifier and accumulator signals illustrated in FIG. 5, the behavior atinputs of the secondary latch of the accumulator indicates the secondarylatch is loaded with the Row X data value. As shown in FIG. 5, thesecondary latch of the accumulator may flip (e.g., see accumulatorsignals for Row X=“0” and Row Y=“0” and for Row X=“1” and Row Y=“0”), ornot flip (e.g., see accumulator signals for Row X=“0” and Row Y=“1” andfor Row X=“1” and Row Y=“1”), depending on the data value previouslystored in the dynamic latch.

After setting the secondary latch from the data values stored in thesense amplifier (and present on the data lines 205-1 (D) and 205-2 (D_),in the pseudo code above, “Deactivate LOAD” indicates that the LOADcontrol signal goes back low as shown at t₅ in FIG. 5 to cause theload/pass transistors 218-1 and 218-2 to stop conducting and therebyisolate the dynamic latch from the complementary data lines. However,the data value remains dynamically stored in secondary latch of theaccumulator.

After storing the data value on the secondary latch, the selected row(e.g., ROW X) is disabled (e.g., deselected, closed such as bydeactivating a select signal for a particular row) as indicated by“Close Row X” and indicated at t₆ in FIG. 5, which can be accomplishedby the access transistor turning off to decouple the selected cell fromthe corresponding data line. Once the selected row is closed and thememory cell is isolated from the data lines, the data lines can beprecharged as indicated by the “Precharge” in the pseudo code above. Aprecharge of the data lines can be accomplished by an equilibrateoperation, as indicated in FIG. 5 by the EQ signal going high at t₇. Asshown in each of the four sets of possible sense amplifier andaccumulator signals illustrated in FIG. 5 at t₇, the equilibrateoperation causes the voltage on data lines D and D_ to each return toV_(DD)/2. Equilibration can occur, for instance, prior to a memory cellsensing operation or the logical operations (described below).

A subsequent operation phase associated with performing the AND or theOR operation on the first data value (now stored in the sense amplifier206 and the secondary latch of the compute component 231) and the seconddata value (stored in a memory cell 202-1 coupled to Row Y 204-Y)includes performing particular steps which depend on the whether an ANDor an OR is to be performed. Examples of pseudo code associated with“ANDing” and “ORing” the data value residing in the accumulator (e.g.,the first data value stored in the memory cell 202-2 coupled to Row X204-X) and the second data value (e.g., the data value stored in thememory cell 202-1 coupled to Row Y 204-Y) are summarized below. Examplepseudo code associated with “ANDing” the data values can include:

Deactivate EQ;

Open Row Y;

Fire Sense Amps (after which Row Y data resides in the sense amps);

Close Row Y;

-   -   The result of the logic operation, in the next operation, will        be placed on the sense amp, which will overwrite any row that is        active;    -   Even when Row Y is closed, the sense amplifier still contains        the Row Y data value;

Activate AND;

-   -   This results in the sense amplifier being written to the value        of the function (e.g., Row X AND Row Y);    -   If the accumulator contains a “0” (i.e., a voltage corresponding        to a “0” on node S2 and a voltage corresponding to a “1” on node        S1), the sense amplifier data is written to a “0”;    -   If the accumulator contains a “1” (i.e., a voltage corresponding        to a “1” on node S2 and a voltage corresponding to a “0” on node        S1), the sense amplifier data remains unchanged (Row Y data);    -   This operation leaves the data in the accumulator unchanged;

Deactivate AND;

Precharge;

In the pseudo code above, “Deactivate EQ” indicates that anequilibration signal corresponding to the sense amplifier 206 isdisabled (e.g., such that the complementary data lines 205-1 (D) and205-2 (D_) are no longer shorted to V_(DD)/2), which is illustrated inFIG. 5 at t₈. After equilibration is disabled, a selected row (e.g., ROWY) is enabled as indicated in the pseudo code above by “Open Row Y” andshown in FIG. 5 at t₉. When the voltage signal applied to ROW Y reachesthe threshold voltage (Vt) of the access transistor (e.g., 202-1)corresponding to the selected cell, the access transistor turns on andcouples the data line (e.g., D_ 205-1) to the selected cell (e.g., tocapacitor 203-1) which creates a differential voltage signal between thedata lines.

After Row Y is enabled, in the pseudo code above, “Fire Sense Amps”indicates that the sense amplifier 206 is enabled to amplify thedifferential signal between 205-1 (D) and 205-2 (D_), resulting in avoltage (e.g., V_(DD)) corresponding to a logic 1 or a voltage (e.g.,GND) corresponding to a logic 0 being on data line 205-1 (D) (and thevoltage corresponding to the other logic state being on complementarydata line 205-2 (D_)). As shown at t₁₀ in FIG. 5, the ACT positivecontrol signal (e.g., 265 shown in FIG. 2B) goes high and the RnIFnegative control signal (e.g., 228 shown in FIG. 2B) goes low to firethe sense amps. The sensed data value from memory cell 202-1 is storedin the primary latch of sense amplifier 206, as previously described.The secondary latch still corresponds to the data value from memory cell202-2 since the dynamic latch is unchanged.

After the second data value sensed from the memory cell 202-1 coupled toRow Y is stored in the primary latch of sense amplifier 206, in thepseudo code above, “Close Row Y” indicates that the selected row (e.g.,ROW Y) can be disabled if it is not desired to store the result of theAND logical operation back in the memory cell corresponding to Row Y.However, FIG. 5 shows that Row Y is left enabled such that the result ofthe logical operation can be stored back in the memory cellcorresponding to Row Y. Isolating the memory cell corresponding to Row Ycan be accomplished by the access transistor turning off to decouple theselected cell 202-1 from the data line 205-1 (D). After the selected RowY is configured (e.g., to isolate the memory cell or not isolate thememory cell), “Activate AND” in the pseudo code above indicates that theAND control signal goes high as shown in FIG. 5 at t₁₁, causing pulldown transistor 207-1 to conduct. In this manner, activating the ANDcontrol signal causes the value of the function (e.g., Row X AND Row Y)to be written to the sense amp.

With the first data value (e.g., Row X) stored in the dynamic latch ofthe accumulator 231 and the second data value (e.g., Row Y) stored inthe sense amplifier 206, if the dynamic latch of the compute component231 contains a “0” (i.e., a voltage corresponding to a “0” on node S2and a voltage corresponding to a “1” on node S1), the sense amplifierdata is written to a “0” (regardless of the data value previously storedin the sense amp) since the voltage corresponding to a “1” on node S1causes transistor 209-1 to conduct thereby coupling the sense amplifier206 to ground through transistor 209-1, pull down transistor 207-1 anddata line 205-1 (D). When either data value of an AND operation is “0,”the result is a “0.” Here, when the second data value (in the dynamiclatch) is a “0,” the result of the AND operation is a “0” regardless ofthe state of the first data value, and so the configuration of thesensing circuitry causes the “0” result to be written and initiallystored in the sense amplifier 206. This operation leaves the data valuein the accumulator unchanged (e.g., from Row X).

If the secondary latch of the accumulator contains a “1” (e.g., from RowX), then the result of the AND operation depends on the data valuestored in the sense amplifier 206 (e.g., from Row Y). The result of theAND operation should be a “1” if the data value stored in the senseamplifier 206 (e.g., from Row Y) is also a “1,” but the result of theAND operation should be a “0” if the data value stored in the senseamplifier 206 (e.g., from Row Y) is also a “0.” The sensing circuitry250 is configured such that if the dynamic latch of the accumulatorcontains a “1” (i.e., a voltage corresponding to a “1” on node S2 and avoltage corresponding to a “0” on node S1), transistor 209-1 does notconduct, the sense amplifier is not coupled to ground (as describedabove), and the data value previously stored in the sense amplifier 206remains unchanged (e.g., Row Y data value so the AND operation result isa “1” if the Row Y data value is a “1” and the AND operation result is a“0” if the Row Y data value is a “0”). This operation leaves the datavalue in the accumulator unchanged (e.g., from Row X).

After the result of the AND operation is initially stored in the senseamplifier 206, “Deactivate AND” in the pseudo code above indicates thatthe AND control signal goes low as shown at t₁₂ in FIG. 5, causing pulldown transistor 207-1 to stop conducting to isolate the sense amplifier206 (and data line 205-1 (D)) from ground. If not previously done, Row Ycan be closed (as shown at t₁₃ in FIG. 5) and the sense amplifier can bedisabled (as shown at t₁₄ in FIG. 5 by the ACT positive control signalgoing low and the RnIF negative control signal goes high). With the datalines isolated, “Precharge” in the pseudo code above can cause aprecharge of the data lines by an equilibrate operation, as describedpreviously (e.g., commencing at t₁₄ shown in FIG. 5).

FIG. 5 shows, in the alternative, the behavior of voltage signals on thedata lines (e.g., 205-1 (D) and 205-2 (D_) shown in FIG. 2A) coupled tothe sense amplifier (e.g., 206 shown in FIG. 2A) and the behavior ofvoltage signals on nodes S1 and S2 of the secondary latch of the computecomponent (e.g., 231 shown in FIG. 2A) for an AND logical operationinvolving each of the possible combination of operands (e.g., Row X/RowY data values 00, 10, 01, and 11).

Although the timing diagrams illustrated in FIG. 5 and the pseudo codedescribed above indicate initiating the AND logical operation afterstarting to load the second operand (e.g., Row Y data value) into thesense amplifier, the circuit shown in FIG. 2A can be successfullyoperated by initiating the AND logical operation before starting to loadthe second operand (e.g., Row Y data value) into the sense amplifier.

FIG. 6 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure. FIG. 6 illustrates atiming diagram associated with initiating an OR logical operation afterstarting to load the second operand (e.g., Row Y data value) into thesense amplifier. FIG. 6 illustrates the sense amplifier and accumulatorsignals for various combinations of first and second operand datavalues. The particular timing diagram signals are discussed below withrespect to the pseudo code associated with an AND logical operation ofthe circuit shown in FIG. 2A.

A subsequent operation phase can alternately be associated withperforming the OR operation on the first data value (now stored in thesense amplifier 206 and the secondary latch of the compute component231) and the second data value (stored in a memory cell 202-1 coupled toRow Y 204-Y). The operations to load the Row X data into the senseamplifier and accumulator that were previously described with respect totimes t₁-t₇ shown in FIG. 5 are not repeated with respect to FIG. 6.Example pseudo code associated with “ORing” the data values can include:

Deactivate EQ;

Open Row Y;

Fire Sense Amps (after which Row Y data resides in the sense amps);

Close Row Y;

-   -   When Row Y is closed, the sense amplifier still contains the Row        Y data value;

Activate OR;

-   -   This results in the sense amplifier being written to the value        of the function (e.g., Row X OR Row Y), which may overwrite the        data value from Row Y previously stored in the sense amplifier        as follows:    -   If the accumulator contains a “0” (i.e., a voltage corresponding        to a “0” on node S2 and a voltage corresponding to a “1” on node        S1), the sense amplifier data remains unchanged (Row Y data);    -   If the accumulator contains a “1” (i.e., a voltage corresponding        to a “1” on node S2 and a voltage corresponding to a “0” on node        S1), the sense amplifier data is written to a “1”;    -   This operation leaves the data in the accumulator unchanged;

Deactivate OR;

Precharge;

The “Deactivate EQ” (shown at t₈ in FIG. 6), “Open Row Y” (shown at t₉in FIG. 6), “Fire Sense Amps” (shown at t₁₀ in FIG. 6), and “Close RowY” (shown at t₁₃ in FIG. 6, and which may occur prior to initiating theparticular logical function control signal), shown in the pseudo codeabove indicate the same functionality as previously described withrespect to the AND operation pseudo code. Once the configuration ofselected Row Y is appropriately configured (e.g., enabled if logicaloperation result is to be stored in memory cell corresponding to Row Yor closed to isolate memory cell if result if logical operation resultis not to be stored in memory cell corresponding to Row Y), “ActivateOR” in the pseudo code above indicates that the OR control signal goeshigh as shown at t₁₁ in FIG. 6, which causes pull down transistor 207-2to conduct. In this manner, activating the OR control signal causes thevalue of the function (e.g., Row X OR Row Y) to be written to the senseamp.

With the first data value (e.g., Row X) stored in the secondary latch ofthe compute component 231 and the second data value (e.g., Row Y) storedin the sense amplifier 206, if the dynamic latch of the accumulatorcontains a “0” (i.e., a voltage corresponding to a “0” on node S2 and avoltage corresponding to a “1” on node S1), then the result of the ORoperation depends on the data value stored in the sense amplifier 206(e.g., from Row Y). The result of the OR operation should be a “1” ifthe data value stored in the sense amplifier 206 (e.g., from Row Y) is a“1,” but the result of the OR operation should be a “0” if the datavalue stored in the sense amplifier 206 (e.g., from Row Y) is also a“0.” The sensing circuitry 250 is configured such that if the dynamiclatch of the accumulator contains a “0,” with the voltage correspondingto a “0” on node S2, transistor 209-2 is off and does not conduct (andpull down transistor 207-1 is also off since the AND control signal isnot asserted) so the sense amplifier 206 is not coupled to ground(either side), and the data value previously stored in the senseamplifier 206 remains unchanged (e.g., Row Y data value such that the ORoperation result is a “1” if the Row Y data value is a “1” and the ORoperation result is a “0” if the Row Y data value is a “0”).

If the dynamic latch of the accumulator contains a “1” (i.e., a voltagecorresponding to a “1” on node S2 and a voltage corresponding to a “0”on node S1), transistor 209-2 does conduct (as does pull down transistor207-2 since the OR control signal is asserted), and the sense amplifier206 input coupled to data line 205-2 (D_) is coupled to ground since thevoltage corresponding to a “1” on node S2 causes transistor 209-2 toconduct along with pull down transistor 207-2 (which also conducts sincethe OR control signal is asserted). In this manner, a “1” is initiallystored in the sense amplifier 206 as a result of the OR operation whenthe secondary latch of the accumulator contains a “1” regardless of thedata value previously stored in the sense amp. This operation leaves thedata in the accumulator unchanged. FIG. 6 shows, in the alternative, thebehavior of voltage signals on the data lines (e.g., 205-1 (D) and 205-2(D_) shown in FIG. 2A) coupled to the sense amplifier (e.g., 206 shownin FIG. 2A) and the behavior of voltage signals on nodes S1 and S2 ofthe secondary latch of the compute component 231 for an OR logicaloperation involving each of the possible combination of operands (e.g.,Row X/Row Y data values 00, 10, 01, and 11).

After the result of the OR operation is initially stored in the senseamplifier 206, “Deactivate OR” in the pseudo code above indicates thatthe OR control signal goes low as shown at t₁₂ in FIG. 6, causing pulldown transistor 207-2 to stop conducting to isolate the sense amplifier206 (and data line D 205-2) from ground. If not previously done, Row Ycan be closed (as shown at t₁₃ in FIG. 6) and the sense amplifier can bedisabled (as shown at t₁₄ in FIG. 6 by the ACT positive control signalgoing low and the RnIF negative control signal going high). With thedata lines isolated, “Precharge” in the pseudo code above can cause aprecharge of the data lines by an equilibrate operation, as describedpreviously and shown at t₁₄ in FIG. 6.

The sensing circuitry 250 illustrated in FIG. 2A can provide additionallogical operations flexibility as follows. By substituting operation ofthe ANDinv control signal for operation of the AND control signal,and/or substituting operation of the ORinv control signal for operationof the OR control signal in the AND and OR operations described above,the logical operations can be changed from {Row X AND Row Y} to {˜Row XAND Row Y} (where “˜Row X” indicates an opposite of the Row X datavalue, e.g., NOT Row X) and can be changed from {Row X OR Row Y} to{˜Row X OR Row Y}. For example, during an AND operation involving theinverted data values, the ANDinv control signal can be asserted insteadof the AND control signal, and during an OR operation involving theinverted data values, the ORInv control signal can be asserted insteadof the OR control signal. Activating the ORinv control signal causestransistor 214-1 to conduct and activating the ANDinv control signalcauses transistor 214-2 to conduct. In each case, asserting theappropriate inverted control signal can flip the sense amplifier andcause the result initially stored in the sense amplifier 206 to be thatof the AND operation using inverted Row X and true Row Y data values orthat of the OR operation using the inverted Row X and true Row Y datavalues. A true or complement version of one data value can be used inthe accumulator to perform the logical operation (e.g., AND, OR), forexample, by loading a data value to be inverted first and a data valuethat is not to be inverted second.

In a similar approach to that described above with respect to invertingthe data values for the AND and OR operations described above, thesensing circuitry shown in FIG. 2A can perform a NOT (e.g., invert)operation by putting the non-inverted data value into the dynamic latchof the accumulator and using that data to invert the data value in thesense amplifier 206. As previously mentioned, activating the ORinvcontrol signal causes transistor 214-1 to conduct and activating theANDinv control signal causes transistor 214-2 to conduct. The ORinvand/or ANDinv control signals are used in implementing the NOT function,as described further below:

Copy Row X into the Accumulator;

-   -   Deactivate EQ;    -   Open Row X;    -   Fire Sense Amps (after which Row X data resides in the sense        amps);    -   Activate LOAD (sense amplifier data (Row X) is transferred to        nodes S1 and S2 of the Accumulator and resides there        dynamically;    -   Deactivate LOAD;    -   Activate ANDinv and ORinv (which puts the compliment data value        on the data lines);        -   This results in the data value in the sense amplifier being            inverted (e.g., the sense amplifier latch is flipped);        -   This operation leaves the data in the accumulator unchanged;    -   Deactivate ANDinv and ORinv;    -   Close Row X;    -   Precharge;

The “Deactivate EQ,” “Open Row X,” “Fire Sense Amps,” “Activate LOAD,”and “Deactivate LOAD” shown in the pseudo code above indicate the samefunctionality as the same operations in the pseudo code for the “CopyRow X into the Accumulator” initial operation phase described aboveprior to pseudo code for the AND operation and OR operation. However,rather than closing the Row X and Precharging after the Row X data isloaded into the sense amplifier 206 and copied into the dynamic latch, acomplement version of the data value in the dynamic latch of theaccumulator can be placed on the data line and thus transferred to thesense amplifier 206 by enabling (e.g., causing transistor to conduct)and disabling the invert transistors (e.g., ANDinv and ORinv). Thisresults in the sense amplifier 206 being flipped from the true datavalue that was previously stored in the sense amplifier to a complementdata value (e.g., inverted data value) stored in the sense amp. That is,a true or complement version of the data value in the accumulator can betransferred to the sense amplifier by activating and deactivating ANDinvand ORinv. This operation leaves the data in the accumulator unchanged.

Because the sensing circuitry 250 shown in FIG. 2A initially stores theresult of the AND, OR, and NOT logical operations in the sense amplifier206 (e.g., on the sense amplifier nodes), these logical operationresults can be communicated easily and quickly to any enabled row, anyrow activated after the logical operation is complete, and/or into thesecondary latch of the compute component 231. The sense amplifier 206and sequencing for the AND, OR, and/or NOT logical operations can alsobe interchanged by appropriate firing of the AND, OR, ANDinv, and/orORinv control signals (and operation of corresponding transistors havinga gate coupled to the particular control signal) before the senseamplifier 206 fires.

When performing logical operations in this manner, the sense amplifier206 can be pre-seeded with a data value from the dynamic latch of theaccumulator to reduce overall current utilized because the sense amps206 are not at full rail voltages (e.g., supply voltage orground/reference voltage) when accumulator function is copied to thesense amplifier 206. An operation sequence with a pre-seeded senseamplifier 206 either forces one of the data lines to the referencevoltage (leaving the complementary data line at V_(DD)/2, or leaves thecomplementary data lines unchanged. The sense amplifier 206 pulls therespective data lines to full rails when the sense amplifier 206 fires.Using this sequence of operations will overwrite data in an enabled row.

A SHIFT operation can be accomplished by multiplexing (“muxing”) twoneighboring data line complementary pairs using a traditional DRAMisolation (ISO) scheme. According to embodiments of the presentdisclosure, the shift circuitry 223 can be used for shifting data valuesstored in memory cells coupled to a particular pair of complementarydata lines to the sensing circuitry 250 (e.g., sense amplifier 206)corresponding to a different pair of complementary data lines (e.g.,such as a sense amplifier 206 corresponding to a left or right adjacentpair of complementary data lines. As used herein, a sense amplifier 206corresponds to the pair of complementary data lines to which the senseamplifier is coupled when isolation transistors 221-1 and 221-2 areconducting. The SHIFT operations (right or left) do not pre-copy the RowX data value into the accumulator. Operations to shift right Row X canbe summarized as follows:

-   -   Deactivate Norm and Activate Shift;    -   Deactivate EQ;    -   Open Row X;    -   Fire Sense Amps (after which shifted Row X data resides in the        sense amps);    -   Activate Norm and Deactivate Shift;    -   Close Row X;    -   Precharge;

In the pseudo code above, “Deactivate Norm and Activate Shift” indicatesthat a NORM control signal goes low causing isolation transistors 221-1and 221-2 of the shift circuitry 223 to not conduct (e.g., isolate thesense amplifier from the corresponding pair of complementary datalines). The SHIFT control signal goes high causing isolation transistors221-3 and 221-4 to conduct, thereby coupling the sense amplifier 206 tothe left adjacent pair of complementary data lines (e.g., on the memoryarray side of non-conducting isolation transistors 221-1 and 221-2 forthe left adjacent pair of complementary data lines).

After the shift circuitry 223 is configured, the “Deactivate EQ,” “OpenRow X,” and “Fire Sense Amps” shown in the pseudo code above indicatethe same functionality as the same operations in the pseudo code for the“Copy Row X into the Accumulator” initial operation phase describedabove prior to pseudo code for the AND operation and OR operation. Afterthese operations, the Row X data value for the memory cell coupled tothe left adjacent pair of complementary data lines is shifted right andstored in the sense amplifier 206.

In the pseudo code above, “Activate Norm and Deactivate Shift” indicatesthat a NORM control signal goes high causing isolation transistors 221-1and 221-2 of the shift circuitry 223 to conduct (e.g., coupling thesense amplifier to the corresponding pair of complementary data lines),and the SHIFT control signal goes low causing isolation transistors221-3 and 221-4 to not conduct and isolating the sense amplifier 206from the left adjacent pair of complementary data lines (e.g., on thememory array side of non-conducting isolation transistors 221-1 and221-2 for the left adjacent pair of complementary data lines). Since RowX is still active, the Row X data value that has been shifted right istransferred to Row X of the corresponding pair of complementary datalines through isolation transistors 221-1 and 221-2.

After the Row X data values are shifted right to the corresponding pairof complementary data lines, the selected row (e.g., ROW X) is disabledas indicated by “Close Row X” in the pseudo code above, which can beaccomplished by the access transistor turning off to decouple theselected cell from the corresponding data line. Once the selected row isclosed and the memory cell is isolated from the data lines, the datalines can be precharged as indicated by the “Precharge” in the pseudocode above. A precharge of the data lines can be accomplished by anequilibrate operation, as described above. Operations to shift left RowX can be summarized as follows:

-   -   Activate Norm and Deactivate Shift;    -   Deactivate EQ;    -   Open Row X;    -   Fire Sense Amps (after which Row X data resides in the sense        amps);    -   Deactivate Norm and Activate Shift;        -   Sense amplifier data (shifted left Row X) is transferred to            Row X;    -   Close Row X;    -   Precharge;

In the pseudo code above, “Activate Norm and Deactivate Shift” indicatesthat a NORM control signal goes high causing isolation transistors 221-1and 221-2 of the shift circuitry 223 to conduct, and the SHIFT controlsignal goes low causing isolation transistors 221-3 and 221-4 to notconduct. This configuration couples the sense amplifier 206 to acorresponding pair of complementary data lines and isolates the senseamplifier from the right adjacent pair of complementary data lines.

After the shift circuitry is configured, the “Deactivate EQ,” “Open RowX,” and “Fire Sense Amps” shown in the pseudo code above indicate thesame functionality as the same operations in the pseudo code for the“Copy Row X into the Accumulator” initial operation phase describedabove prior to pseudo code for the AND operation and OR operation. Afterthese operations, the Row X data value for the memory cell coupled tothe pair of complementary data lines corresponding to the sensecircuitry 250 is stored in the sense amplifier 206.

In the pseudo code above, “Deactivate Norm and Activate Shift” indicatesthat a NORM control signal goes low causing isolation transistors 221-1and 221-2 of the shift circuitry 223 to not conduct (e.g., isolate thesense amplifier from the corresponding pair of complementary datalines), and the SHIFT control signal goes high causing isolationtransistors 221-3 and 221-4 to conduct coupling the sense amplifier tothe left adjacent pair of complementary data lines (e.g., on the memoryarray side of non-conducting isolation transistors 221-1 and 221-2 forthe left adjacent pair of complementary data lines. Since Row X is stillactive, the Row X data value that has been shifted left is transferredto Row X of the left adjacent pair of complementary data lines.

After the Row X data values are shifted left to the left adjacent pairof complementary data lines, the selected row (e.g., ROW X) is disabledas indicated by “Close Row X,” which can be accomplished by the accesstransistor turning off to decouple the selected cell from thecorresponding data line. Once the selected row is closed and the memorycell is isolated from the data lines, the data lines can be prechargedas indicated by the “Precharge” in the pseudo code above. A precharge ofthe data lines can be accomplished by an equilibrate operation, asdescribed above.

According to various embodiments, general computing can be enabled in amemory array core of a processor-in-memory (PIM) device such as a DRAMone transistor per memory cell (e.g., 1T1C) configuration at 6F̂2 or 4F̂2memory cell sizes, for example. A potential advantage of the apparatusesand methods described herein may not be realized in terms of singleinstruction speed, but rather can be realized in the cumulative speedthat can be achieved by an entire bank of data being computed inparallel without ever transferring data out of the memory array (e.g.,DRAM) or firing a column decode. In other words, data transfer time canbe eliminated. For example, apparatus of the present disclosure canperform ANDs or ORs simultaneously using data values in memory cellscoupled to a data line (e.g., a column of 16K memory cells).

In previous approach sensing circuits where data is moved out forlogical operation processing (e.g., using 32 or 64 bit registers), feweroperations can be performed in parallel compared to the apparatus of thepresent disclosure. In this manner, significantly higher throughput iseffectively provided in contrast to conventional configurationsinvolving a central processing unit (CPU) discrete from the memory suchthat data must be transferred therebetween. An apparatus and/or methodsaccording to the present disclosure can also use less energy/area thanconfigurations where the CPU is discrete from the memory. Furthermore,an apparatus and/or methods of the present disclosure can improve uponthe smaller energy/area advantages since the in-memory-array logicaloperations save energy by eliminating certain data value transfers.

FIG. 7 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure. The functionality ofthe sensing circuitry 250 of FIG. 2A is described below with respect toperforming logical operations and initially storing a result in thecompute component 231 (e.g., secondary latch of the accumulator). Thetiming diagram shown in FIG. 7 illustrates signals (e.g., voltagesignals) associated with performing a first operation phase of a logicaloperation (e.g., an R-input logical operation) using the sensingcircuitry illustrated in FIG. 2A. The first operation phase describedwith respect to FIG. 7 can be a first operation phase of an AND, NAND,OR, or NOR operation, for instance. Performing the operation phaseillustrated in FIG. 7 can involve consuming significantly less energy(e.g., about half) than previous processing approaches that may involveproviding a full swing between voltage rails (e.g., between a supply andground).

In the example illustrated in FIG. 7, the voltage rails corresponding tocomplementary logic values (e.g., “1” and “0”) are a supply voltage(V_(DD)) and a reference voltage (e.g., ground (Gnd)). Prior toperforming a logical operation, an equilibration can occur such that thecomplementary data lines D and D_ are shorted together at anequilibration voltage (V_(DD)/2), as previously described.

The first operation phase of a logical operation described belowinvolves loading a first operand of the logical operation into theaccumulator. The time references (e.g., t₁, etc.) shown in FIG. 7 do notnecessarily represent a same absolute or relative time as similar timereferences in other timing diagrams.

t time t₁, the equilibration signal 726 is deactivated, and then aselected row is enabled (e.g., the row corresponding to a memory cellwhose data value is to be sensed and used as a first input). Signal704-0 represents the voltage signal applied to the selected row (e.g.,Row Y 204-Y shown in FIG. 2A). When row signal 704-0 reaches thethreshold voltage (Vt) of the access transistor (e.g., 202-1 shown inFIG. 2A) corresponding to the selected cell, the access transistor turnson and couples the data line D to the selected memory cell (e.g., to thecapacitor 203-1 shown in FIG. 2A if the cell is a 1T1C DRAM cell), whichcreates a differential voltage signal between the data lines D and D_(e.g., as indicated by signals 705-1 and 705-2 on the data lines,respectively) between times t₂ and t₃. The voltage of the selected cellis represented by signal 703. Due to conservation of energy, creatingthe differential signal between data lines D and D_ (e.g., by couplingthe cell to data line D) does not consume energy, since the energyassociated with enabling/disabling the row signal 704-0 can be amortizedover the plurality of memory cells coupled to the row.

At time t₃, the sense amplifier (e.g., 206 shown in FIG. 2A) isactivated (e.g., a positive control signal 765 (e.g., corresponding toACT 265 shown in FIG. 2B) goes high and the negative control signal 728(e.g., corresponding to RnIF 228 shown in FIG. 2B) goes low), whichamplifies the differential signal between data lines D and D_, resultingin a voltage (e.g., V_(DD)) corresponding to a logic “1” or a voltage(e.g., ground) corresponding to a logic “0” being on data line D (andthe other voltage being on complementary data line D_), such that thesensed data value is stored in the primary latch of sense amplifier 206.The primary energy consumption occurs in charging the data line D(205-1) from the equilibration voltage V_(DD)/2 to the rail voltageV_(DD). FIG. 7 shows, in example, the data line voltages 705-1 and 705-2that correspond to a logic “1” being on data line D.

According to some embodiments, the primary latch of sense amplifier 206can be coupled to the complementary data lines D and D_ throughrespective pass transistors (not shown in FIG. 2B but in a similarconfiguration as the manner in which latch 264 is coupled to the datalines D and D_ through load/pass transistors 218-1 and 218-2 shown inFIG. 2A). The Passd control signal 711 controls one pass transistor. ThePassdb control signal controls the other pass transistor, and here thePassdb control signal can behave here the same as the Passd controlsignal.

At time t₄, the pass transistors (if present) can be enabled (e.g., viarespective Passd and Passdb control signals 711 applied to control linescoupled to the respective gates of the pass transistors going high). Attime t₅, the accumulator positive control signal 712-1 (e.g., Accumb)and the accumulator positive control signal 712-2 (e.g., Accum) areactivated via respective control lines 212-1 and 212-2 shown in FIG. 2A.As described below, the accumulator control signals ACCUMB 712-1 andACCUM 712-2 may remain activated for subsequent operation phases. Assuch, in this example, activating the control signals ACCUMB 712-1 andACCUM 712-2 enables the secondary latch (e.g., accumulator) of computecomponent 231-6 shown in FIG. 2A. The sensed data value stored in senseamplifier 206 is transferred (e.g., copied) to the secondary latch,including the dynamic latch and latch 264.

At time t₆, the Passd control signal 711 (and the Passdb control signal)goes low thereby turning off the pass transistors (if present). However,since the accumulator control signals ACCUMB 712-1 and ACCUM 712-2remain activated, an accumulated result is stored (e.g., latched) in thesecondary latches (e.g., accumulator). At time t₇, the row signal 704-0is deactivated, and the array sense amps are disabled at time t₈ (e.g.,sense amplifier control signals 728 and 765 are deactivated).

At time t₉, the data lines D and D_ are equilibrated (e.g.,equilibration signal 726 is activated), as illustrated by data linevoltage signals 705-1 and 705-2 moving from their respective rail valuesto the equilibration voltage (V_(DD)/2). The equilibration consumeslittle energy due to the law of conservation of energy. As describedbelow in association with FIG. 2B, equilibration can involve shortingthe complementary data lines D and D_ together at an equilibrationvoltage, which is V_(DD)/2, in this example. Equilibration can occur,for instance, prior to a memory cell sensing operation.

FIGS. 8 and 9 respectively illustrate timing diagrams associated withperforming a number of logical operations using sensing circuitry inaccordance with a number of embodiments of the present disclosure.Timing diagrams shown in FIGS. 8 and 9 illustrate signals (e.g., voltagesignals) associated with performing a number of intermediate operationphases of a logical operation (e.g., an R-input logical operation). Forinstance, timing diagram shown in FIG. 8 corresponds to a number ofintermediate operation phases of an R-input NAND operation or an R-inputAND operation, and timing diagram shown in FIG. 9 corresponds to anumber of intermediate operation phases of an R-input NOR operation oran R-input OR operation. For example, performing an AND or NANDoperation can include performing the operation phase shown in FIG. 8 oneor more times subsequent to an initial operation phase such as thatdescribed with respect to FIG. 7. Similarly, performing an OR or NORoperation can include performing the operation phase shown and describedwith respect to FIG. 9 one or more times subsequent to an initialoperation phase such as that described with respect to FIG. 7.

As shown in the timing diagrams illustrated in FIGS. 8 and 9, at timet₁, equilibration is disabled (e.g., the equilibration signal 826/926 isdeactivated), and then a selected row is enabled (e.g., the rowcorresponding to a memory cell whose data value is to be sensed and usedas an input such as a second input, third input, etc.). Signal804-1/904-1 represents the voltage signal applied to the selected row(e.g., Row Y 204-Y shown in FIG. 2A). When row signal 804-1 reaches thethreshold voltage (Vt) of the access transistor (e.g., 202-1 shown inFIG. 2A) corresponding to the selected cell, the access transistor turnson and couples the data line D to the selected memory cell (e.g., to thecapacitor 203-1 if the cell is a 1T1C DRAM cell), which creates adifferential voltage signal between the data lines D and D_ (e.g., asindicated by signals 805-1/905-1 and 805-2/905-2, respectively) betweentimes t₂ and t₃. The voltage of the selected cell is represented bysignal 803/903. Due to conservation of energy, creating the differentialsignal between D and D_ (e.g., by coupling the cell to data line D) doesnot consume energy, since the energy associated withactivating/deactivating the row signal 804-1/904-1 can be amortized overthe plurality of memory cells coupled to the row.

At time t₃, the sense amplifier (e.g., 206 shown in FIG. 2A) is enabled(e.g., a positive control signal 865/965 (e.g., corresponding to ACT 233shown in FIG. 2B) goes high, and the negative control signal 828/928(e.g., RnIF 228 shown in FIG. 2B) goes low), which amplifies thedifferential signal between D and D_, resulting in a voltage (e.g.,V_(DD)) corresponding to a logic 1 or a voltage (e.g., ground)corresponding to a logic 0 being on data line D (and the other voltagebeing on complementary data line D_), such that the sensed data value isstored in the primary latch of sense amplifier 206. The primary energyconsumption occurs in charging the data line D (205-1) from theequilibration voltage V_(DD)/2 to the rail voltage V_(DD).

As shown in timing diagrams illustrated in FIGS. 8 and 9, at time t₄(e.g., after the selected cell is sensed), only one of control signals811-1 (Passd) shown in FIGS. 8 and 911-2 (Passdb) shown in FIG. 9 isactivated (e.g., only one of pass transistors (if present) is enabled),depending on the particular logic operation. For example, since thetiming diagram illustrated in FIG. 8 corresponds to an intermediatephase of a NAND or AND operation, control signal 811-1 (Passd) isactivated at time t₄ to turn on the pass transistor coupling the primarylatch to data line D and the Passdb control signal remains deactivatedleaving the pass transistor coupling the primary latch to data line D_turned off. Conversely, since the timing diagram illustrated in FIG. 9corresponds to an intermediate phase of a NOR or OR operation, controlsignal 911-2 (Passdb) is activated at time t₄ to turn on the passtransistor coupling the primary latch to data line D_ and control signalPassd remains deactivated leaving the pass transistor coupling theprimary latch to data line D turned off. Recall from above that theaccumulator control signals 712-1 (Accumb) and 712-2 (Accum) wereactivated during the initial operation phase described with respect toFIG. 7, and they remain activated during the intermediate operationphase(s).

Since the accumulator was previously enabled, activating only Passd(811-1 as shown in FIG. 8) results in accumulating the data valuecorresponding to the voltage signal 805-1 shown in FIG. 8 correspondingto data line D. Similarly, activating only Passdb (911-2 as shown inFIG. 9) results in accumulating the data value corresponding to thevoltage signal 905-2 corresponding to data line D_. For instance, in anexample AND/NAND operation shown in the timing diagram illustrated inFIG. 8 in which only Passd (811-1) is activated, if the data valuestored in the second selected memory cell is a logic “0,” then theaccumulated value associated with the secondary latch is asserted lowsuch that the secondary latch stores logic “0.” If the data value storedin the second selected memory cell is not a logic “0,” then thesecondary latch retains its stored first selected memory cell data value(e.g., a logic “1” or a logic “0”). As such, in this AND/NAND operationexample, the secondary latch is serving as a zeroes (Os) accumulator.

Similarly, in an example OR/NOR operation shown in the timing diagramillustrated in FIG. 9 in which only Passdb 911-2 is activated, if thedata value stored in the second selected memory cell is a logic “1,”then the accumulated value associated with the secondary latch isasserted high such that the secondary latch stores logic “1.” If thedata value stored in the second selected memory cell is not a logic “1,”then the secondary latch retains its stored first selected memory celldata value (e.g., a logic “1” or a logic “0”). As such, in this OR/NORoperation example, the secondary latch is effectively serving as a ones(is) accumulator since voltage signal 905-2 on D_ is setting the truedata value of the accumulator.

At the conclusion of an intermediate operation phase such as that shownin FIG. 8 or 9, the Passd signal 811-1 (e.g., for AND/NAND) or thePassdb signal 911-2 (e.g., for OR/NOR) is deactivated (e.g., at timet5), the selected row is disabled (e.g., at time t6), the senseamplifier is disabled (e.g., at time t7), and equilibration occurs(e.g., at time t8). An intermediate operation phase such as thatillustrated in FIG. 8 or 9 can be repeated in order to accumulateresults from a number of additional rows. As an example, the sequence oftiming diagram illustrated in FIGS. 8 and/or 9 can be performed asubsequent (e.g., second) time for a third memory cell, a subsequent(e.g., third) time for a fourth memory cell, etc. For instance, for a10-input NOR operation, the intermediate phase shown in FIG. 9 can occur9 times to provide 9 inputs of the 10-input logical operation, with thetenth input being determined during the initial operation phase (e.g.,as described with respect to FIG. 7).

FIG. 10 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure. The timing diagramillustrated in FIG. 10 shows signals (e.g., voltage signals) associatedwith performing a last operation phase of a logical operation (e.g., anR-input logical operation). For instance, the timing diagram illustratedin FIG. 10 corresponds to a last operation phase of an R-input ANDoperation or an R-input OR operation.

For example, performing a last operation phase of an R-input can includeperforming the operation phase shown in FIG. 10 subsequent to a numberof iterations of the intermediate operation phase(s) described inassociation with FIGS. 8 and/or 9. Table 2 shown below indicates theFigures corresponding to the sequence of operation phases associatedwith performing a number of R-input logical operations in accordancewith a number of embodiments described herein.

TABLE 2 Operation FIG. 7 FIG. 8 FIG. 9 FIG. 10 AND First phase R-1 Lastphase iterations NAND First phase R-1 iterations OR First phase R-1 Lastphase iterations NOR First phase R-1 iterations

A NAND operation can be implemented, for example, by storing the resultof the R-1 iterations for an AND operation in the sense amplifier, theninverting the sense amplifier before conducting the last operation phaseto store the result (described below). A NOR operation can beimplemented, for example, by storing the result of the R-1 iterationsfor an OR operation in the sense amplifier, then inverting the senseamplifier before conducting the last operation phase to store the result(described below).

The last operation phase illustrated in the timing diagram of FIG. 10 isdescribed in association with storing a result of an R-input logicaloperation to a row of the array (e.g., array 230 shown in FIG. 2A).However, as described above, in a number of embodiments, the result canbe stored to a suitable location other than back to the array (e.g., toan external register associated with a controller and/or host processor,to a memory array of a different memory device, etc., via I/O lines).

As shown in timing diagram illustrated in FIG. 10, at time t₁,equilibration is disabled (e.g., the equilibration signal 1026 isdeactivated) such that data lines D and D_ are floating. At time t2, thePassd control signal 1011 (and Passdb signal) is activated for an AND orOR operation.

Activating the Passd control signal 1011 (and Passdb signal) (e.g., inassociation with an AND or OR operation) transfers the accumulatedoutput stored in the secondary latch of compute component 231-6 shown inFIG. 2A to the primary latch of sense amplifier 206. For instance, foran AND operation, if any of the memory cells sensed in the prioroperation phases (e.g., the first operation phase illustrated in FIG. 7and one or more iterations of the intermediate operation phaseillustrated in FIG. 8) stored a logic “0” (e.g., if any of the R-inputsof the AND operation were a logic “0”), then the data line D_ will carrya voltage corresponding to logic “1” (e.g., V_(DD)) and data line D willcarry a voltage corresponding to logic “0” (e.g., ground). For this ANDoperation example, if all of the memory cells sensed in the prioroperation phases stored a logic “1” (e.g., all of the R-inputs of theAND operation were logic “1”), then the data line D_ will carry avoltage corresponding to logic “0” and data line D will carry a voltagecorresponding to logic “1”. At time t3, the primary latch of senseamplifier 206 is then enabled (e.g., a positive control signal 1065(e.g., corresponding to ACT 265 shown in FIG. 2B) goes high and thenegative control signal 1028 (e.g., corresponding to RnIF 228 shown inFIG. 2B) goes low), which amplifies the differential signal between datalines D and D_ such that the data line D now carries the ANDed result ofthe respective input data values as determined from the memory cellssensed during the prior operation phases. As such, data line D will beat ground if any of the input data values are a logic “0” and data lineD will be at V_(DD) if all of the input data values are a logic “1.”

For an OR operation, if any of the memory cells sensed in the prioroperation phases (e.g., the first operation phase of FIG. 7 and one ormore iterations of the intermediate operation phase shown in FIG. 9)stored a logic “1” (e.g., if any of the R-inputs of the OR operationwere a logic “1”), then the data line D_ will carry a voltagecorresponding to logic “0” (e.g., ground) and data line D will carry avoltage corresponding to logic “1” (e.g., V_(DD)). For this OR example,if all of the memory cells sensed in the prior operation phases stored alogic “0” (e.g., all of the R-inputs of the OR operation were logic“0”), then the data line D will carry a voltage corresponding to logic“0” and data line D_ will carry a voltage corresponding to logic “1.” Attime t3, the primary latch of sense amplifier 206 is then enabled andthe data line D now carries the ORed result of the respective input datavalues as determined from the memory cells sensed during the prioroperation phases. As such, data line D will be at V_(DD) if any of theinput data values are a logic “1” and data line D will be at ground ifall of the input data values are a logic “0.”

The result of the R-input AND or OR logical operations can then bestored back to a memory cell of array 230 shown in FIG. 2A. In theexamples shown in FIG. 10, the result of the R-input logical operationis stored to a memory cell coupled to the last row enabled (e.g., row ofthe last logical operation operand). Storing the result of the logicaloperation to a memory cell simply involves enabling the associated rowaccess transistor by enabling the particular row. The capacitor of thememory cell will be driven to a voltage corresponding to the data valueon the data line D (e.g., logic “1” or logic “0”), which essentiallyoverwrites whatever data value was previously stored in the selectedmemory cell. It is noted that the selected memory cell can be a samememory cell that stored a data value used as an input for the logicaloperation. For instance, the result of the logical operation can bestored back to a memory cell that stored an operand of the logicaloperation.

The timing diagram illustrated in FIG. 10 shows, at time t7, thepositive control signal 1065 and the negative control signal 1028 beingdeactivated (e.g., signal 1065 goes low and signal 1028 goes high) todisable the sense amplifier 206 shown in FIG. 2A. At time t4 the Passdcontrol signal 1011 (and Passdb signal) that was activated at time t2 isdeactivated. Embodiments are not limited to this example. For instance,in a number of embodiments, the sense amplifier 206 shown in FIG. 2A maybe enabled subsequent to time t4 (e.g., after the Passd control signal1011 (and Passdb signal) are deactivated).

As shown in FIG. 10, at time t5, a selected row is enabled (e.g., by rowactivation signal 1004 going high, which drives the capacitor of theselected cell to the voltage corresponding to the logic value stored inthe accumulator. At time t6 the selected row is disabled. At time t7 thesense amplifier 206 shown in FIG. 2A is disabled (e.g., positive controlsignal 1028 and negative control signal 1065 are deactivated), and attime t8 equilibration occurs (e.g., signal 1026 is activated and thevoltages on the complementary data lines 1005-1 (D) and 1005-2 (D_) arebrought to the equilibration voltage).

Although the example of performing a last operation phase of an R-inputwas discussed above with respect to FIG. 10 for performing AND and ORlogical operations, embodiments are not limited to these logicaloperations. For example, the NAND and NOR operations can also involve alast operation phase of an R-input that is stored back to a memory cellof array 230 using control signals to operate the sensing circuitryillustrated in FIG. 2A.

FIG. 11 is a schematic diagram illustrating sensing circuitry havingselectable logical operation selection logic in accordance with a numberof embodiments of the present disclosure. FIG. 11 shows a senseamplifier 1106 coupled to a pair of complementary sense lines 1105-1 and1105-2, and a compute component 1131 coupled to the sense amplifier 1106via pass gates 1193-1 and 1193-2. The gates of the pass gates 1193-1 and1193-2 can be controlled by a logical operation selection logic signal,PASS, which can be output from logical operation selection logic 1113-5.FIG. 11 shows the compute component 1131 labeled “A” and the senseamplifier 1106 labeled “B” to indicate that the data value stored in thecompute component 1131 is the “A” data value and the data value storedin the sense amplifier 1106 is the “B” data value shown in the logictables illustrated with respect to FIG. 12.

The sensing circuitry 1150 illustrated in FIG. 11 includes logicaloperation selection logic 1113-5. In this example, the logic 1113-5comprises swap gates 1142 controlled by a logical operation selectionlogic signal PASS*. The logical operation selection logic 1113-5 alsocomprises four logic selection transistors: logic selection transistor1162 coupled between the gates of the swap transistors 1142 and a TFsignal control line, logic selection transistor 1152 coupled between thegates of the pass gates 1193-1 and 1193-2 and a TT signal control line,logic selection transistor 1154 coupled between the gates of the passgates 1193-1 and 1193-2 and a FT signal control line, and logicselection transistor 1164 coupled between the gates of the swaptransistors 1142 and a FF signal control line. Gates of logic selectiontransistors 1162 and 1152 are coupled to the true sense line (e.g.,1105-1) through isolation transistor 1150-1 (having a gate coupled to anISO signal control line), and gates of logic selection transistors 1164and 1154 are coupled to the complementary sense line (e.g., 1105-2)through isolation transistor 1150-2 (also having a gate coupled to anISO signal control line).

Logic selection transistors 1152 and 1154 are arranged similarly totransistor 507-1 (coupled to an AND signal control line) and transistor507-2 (coupled to an OR signal control line) respectively, as shown inFIG. 5. Operation of logic selection transistors 1152 and 1154 aresimilar based on the state of the TT and FT selection signals and thedata values on the respective complementary sense lines at the time theISO signal is asserted. Logic selection transistors 1162 and 1164 alsooperate in a similar manner to control (e.g., enable by turning on ordisable by turning off) the swap transistors 1142. That is, to enable(e.g., turn on) the swap transistors 1142, either the TF control signalis activated (e.g., high) with data value on the true sense line being“1,” or the FF control signal is activated (e.g., high) with the datavalue on the complement sense line being “1.” If either the respectivecontrol signal or the data value on the corresponding sense line (e.g.,sense line to which the gate of the particular logic selectiontransistor is coupled) is not high, then the swap transistors 1142 willnot be enabled by a particular logic selection transistor.

The PASS* control signal is not necessarily complementary to the PASScontrol signal. For instance, it is possible for the PASS and PASS*control signals to both be activated or both be deactivated at the sametime. However, activation of both the PASS and PASS* control signals atthe same time shorts the pair of complementary sense linesDIGIT(n)/DIGIT(n)_together, which may be a disruptive configuration tobe avoided. Logical operations results for the sensing circuitryillustrated in FIG. 11 are summarized in the logic table illustrated inFIG. 12.

FIG. 12 is a logic table illustrating selectable logic operation resultsimplementable by the sensing circuitry shown in FIG. 11 in accordancewith a number of embodiments of the present disclosure. The four logicselection control signals (e.g., TF, TT, FT, and FF), in conjunctionwith a particular data value present on the complementary sense lines,can be used to select one of plural logical operations to implementinvolving the starting data values stored in the sense amplifier 1106and compute component 1131. The four control signals (e.g., TF, TT, FT,and FF), in conjunction with a particular data value present on thecomplementary sense lines, controls the pass gates 1193-1 and 1193-2 andswap transistors 1142, which in turn affects the data value in thecompute component 1131 and/or sense amplifier 1106 before/after firing.The capability to selectably control the swap transistors 1142facilitates implementing logical operations involving inverse datavalues (e.g., inverse operands and/or inverse result), among others.

The logic table illustrated in FIG. 12 shows the starting data valuestored in the compute component 1131 shown in column A at 1244, and thestarting data value stored in the sense amplifier 1106 shown in column Bat 1245. The other 3 top column headings (NOT OPEN 1256, OPEN TRUE 1270,and OPEN INVERT 1271) in the logic table of FIG. 12 refer to the stateof the pass gates 1193-1 and 1193-2, and the swap transistors 1142,which can respectively be controlled to be OPEN or CLOSED depending onthe state of the four logic selection control signals (e.g., TF, TT, FT,and FF), in conjunction with a particular data value present on the pairof complementary sense lines 1105-1 and 1105-2 when the ISO controlsignal is asserted. The “Not Open” column corresponds to the pass gates1193-1 and 1193-2 and the swap transistors 1142 both being in anon-conducting (e.g., off) condition, the “Open True” corresponds to thepass gates 1193-1 and 1193-2 being in a conducting (e.g., on) condition,and the “Open Invert” corresponds to the swap transistors 1142 being ina conducting condition. The configuration corresponding to the passgates 1193-1 and 1193-2 and the swap transistors 1142 both being in aconducting condition is not reflected in the logic table of FIG. 12since this results in the sense lines being shorted together.

Via selective control of the pass gates 1193-1 and 1193-2 and the swaptransistors 1142, each of the three columns of the first set of two rowsof the upper portion of the logic table of FIG. 12 can be combined witheach of the three columns of the second set of two rows below the firstset to provide 3×3=9 different result combinations, corresponding tonine different logical operations, as indicated by the variousconnecting paths shown at 1275. The nine different selectable logicaloperations that can be implemented by the sensing circuitry 1150 aresummarized in the logic table illustrated in FIG. 12.

The columns of the lower portion of the logic table illustrated in FIG.12 show a heading 1280 that includes the state of logic selectioncontrol signals. For example, the state of a first logic selectioncontrol signal (e.g., FF) is provided in row 1276, the state of a secondlogic selection control signal (e.g., FT) is provided in row 1277, thestate of a third logic selection control signal (e.g., TF) is providedin row 1278, and the state of a fourth logic selection control signal(e.g., TT) is provided in row 1279. The particular logical operationcorresponding to the results is summarized in row 1247.

As such, the sensing circuitry shown in FIG. 11 can be used to performvarious logical operations as shown in FIG. 12. For example, the sensingcircuitry 1150 can be operated to perform various logical operations(e.g., AND and OR logical operations) in association with determiningpopulation count in accordance with a number of embodiments of thepresent disclosure.

The present disclosure includes apparatuses and methods related toperforming division operations in memory. An example apparatus mightinclude a first group of memory cells coupled to a first access line andconfigured to store a dividend element. An example apparatus mightinclude a second group of memory cells coupled to a second access lineand configured to store a divisor element. An example apparatus mightalso include sensing circuitry configured to divide the dividend elementby the divisor element by performing a number of AND operations, ORoperations, SHIFT operations, and INVERT operations without transferringdata via an input/output (I/O) line.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of one or more embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of the one or moreembodiments of the present disclosure includes other applications inwhich the above structures and methods are used. Therefore, the scope ofone or more embodiments of the present disclosure should be determinedwith reference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

1-13. (canceled)
 14. A system comprising: a first group of memory cellscoupled to a first access line and configured to store a dividendelement; a second group of memory cells coupled to a second access lineand configured to store a divisor element; and a controller configuredto cause the dividend element to be divided by the divisor element bycontrolling sensing circuitry to perform a number of operations; whereinperforming the number of operations comprises: storing, as a first maskbit-vector, a bit pattern indicating at least one of a most significantbit (MSB) and a least significant bit (LSB) of at least one of adividend bit-vector comprising the dividend element and a divisorbit-vector comprising the divisor element; storing, as a second maskbit-vector, a bit pattern indicating at least one of the mostsignificant bit (MSB) and the least significant bit (LSB) of multipleelements of at least one of the dividend bit-vector and the divisorbit-vector; and performing a logical operation on the first maskbit-vector and a bit-vector stored in the sensing circuitry.
 15. Thesystem of claim 14, further comprising a memory device, including thefirst group of memory cells, the second group of memory cells, and thecontroller, coupled to a host.
 16. The system of claim 14, wherein thehost comprises a number of processors.
 17. The system of claim 14,wherein the hosts provides an element width of the dividend bit-vectorand the divisor bit-vector to the memory device and wherein the numberof operations are performed in view of the element width.
 18. The systemof claim 14, wherein the number of operations comprises a number of ANDoperations, OR operations, and SHIFT operations.
 19. The system of claim18, wherein the sensing circuitry comprises a number of transistorsformed on pitch with the memory cells and a sense amplifier and acompute component.
 20. The system of claim 19, wherein the senseamplifier comprises a primary latch and the compute component comprisesa secondary latch.
 21. A system comprising: a memory array comprising: afirst group of memory cells coupled to a first access line andconfigured to store a plurality of dividend elements as a dividendbit-vector; and a second group of memory cells coupled to a secondaccess line and configured to store a plurality of divisor elements as adivisor bit-vector; and a controller configured to control sensingcircuitry to: perform a plurality of division operations by dividing, inparallel, each one of the plurality of dividend elements by a respectiveone of the plurality of divisor elements; store a plurality of resultsof the plurality of division operations in a third group of memorycells; and wherein performing the plurality of division operationscomprises: storing, as a first mask bit-vector, a bit pattern indicatingat least one of a most significant bit (MSB) and a least significant bit(LSB) of at least one of the dividend bit-vector and the divisorbit-vector; storing, as a second mask bit-vector, a bit patternindicating at least one of the most significant bit (MSB) and the leastsignificant bit (LSB) of respective elements of at least one of thedividend bit-vector and the divisor bit-vector; and performing a logicaloperation on the first mask bit-vector and a bit-vector stored insensing circuitry coupled to the memory array.
 22. The system of claim21, wherein the memory array is located on a memory device coupled to ahost.
 23. The system of claim 21, wherein the plurality of resultscomprise a plurality of bit-vectors that represent at least one of aplurality of quotient elements and a plurality of remainder elements.24. The system of claim 21, wherein the third group of memory cells is asame group of memory cells as at least one of: the first group of memorycells coupled to the first access line; and the second group of memorycells coupled to the second access line.
 25. The system of claim 21,wherein each of the plurality of division operations is performed on adifferent element pair including corresponding elements from theplurality of dividend elements and the plurality of divisor elements.26. A method of a system for performing division operations, comprising:performing, in parallel, a plurality of division operations on: aplurality (M) of dividend elements stored in a first group of memorycells coupled to a first access line and to a number (X) of sense linesof a memory array; and a plurality (M) of divisor elements stored in asecond group of memory cells coupled to a second access line and to theX of sense lines of the memory array; and providing a plurality ofquotient elements and a plurality of remainder elements; whereinperforming the plurality of division operations comprises: storing, as amask bit-vector, a bit pattern indicating at least one of a mostsignificant bit (MSB) and a least significant bit (LSB) of at least oneof a dividend bit-vector comprising the plurality of dividend elementsand a divisor bit-vector comprising the plurality of divisor elements;and performing a logical operation on the mask bit-vector and abit-vector stored in sensing circuitry coupled to the memory array. 27.The method of claim 26, wherein the plurality of dividend elements are aplurality of first values and the plurality of divisor elements are aplurality of second values.
 28. The method of claim 27, wherein theplurality of first values are stored in the first group of memory cellsas the dividend bit-vector and the plurality of second values are storedin the second group of memory cells as the divisor bit-vector.
 29. Themethod of claim 26, wherein a number of operations used to perform theplurality of division operations in parallel is the same as a number ofoperations used to perform any one of the plurality of divisionoperations.
 30. The method of claim 26, wherein the mask bit-vectorcomprises at least one of a dynamic mask bit-vector and a static maskbit-vector and wherein performing the plurality of division operationsincludes performing a number (E) of iterations of operations.
 31. Themethod of claim 30, wherein performing each of the E iterations ofoperations comprises: storing the dynamic mask bit-vector, thatidentifies a MSB for each of the M dividend elements and the M divisorelements, in the sensing circuitry and in a group of memory cells thatstore a current dividend bit-vector; and performing a number (P) ofiterations of operations, comprising: shifting the current dividendbit-vector stored in the sensing circuitry; inverting the shiftedbit-vector in the sensing circuitry; performing a first logicaloperation on the inverted bit-vector in the sensing circuitry and thestatic mask bit-vector that identify the MSB for each of the M dividendelements and the M divisor elements; storing the result of the firstlogical operation in the sensing circuitry; inverting the result of thefirst logical operation in the sensing circuitry; and performing asecond logical operation on the inverted result in the sensing circuitryand the current dividend bit-vector; and storing the result of thesecond logical operation performed on the inverted result and thecurrent dividend bit-vector in the group of memory cells that store thecurrent dividend bit-vector.
 32. The method of claim 26, wherein each ofthe M dividend elements and the M divisor elements are comprised of Nbits.
 33. The method of claim 32, wherein each of the N bits in each ofthe M dividend elements and the M divisor elements are associated withan index and wherein bits from corresponding elements that areassociated with a same index are stored in memory cells that are coupledto a same sense line from the X sense lines.